Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders

doi:10.1016/j.matchemphys.2011.08.061

IMR OpenIR

	Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders
	Zou, H. F.1,2; Yang, H. J.1; Zhang, Z. F.1
通讯作者	Zhang, Z. F.(zhfzhang@imr.ac.cn)
	2011-12-15
发表期刊	MATERIALS CHEMISTRY AND PHYSICS
ISSN	0254-0584
卷号	131 期号:1-2 页码:190-198
摘要	During the reflowing procedure, the Cu concentration in the solder affects the coarsening mechanisms of intermetallic compound (IMC) grains. For the Sn3Cu solder, the mean radius of the IMC grains was proportional to the cube root of the reflowing time; while it follows the square root relation with the reflowing time for the SnAgCu and Sn solders. It is proposed that the flux from the substrate was only consumed to coarsen the IMC grains for Sn3Cu solder, while it was separated into two fluxes for the SnAgCu and Sn solders at the reflowing initial procedure. For the Sn3.8Ag0.7Cu/Cu and Sn/Cu couples, the size distribution of the IMC grains well agrees with the modified flux driven ripening (FDR) model when the value of r/(r) is above 1; while it would closely match with Marqusee and Ross analysis when the value of r/(r) is below 1. For Sn3Cu/Cu couple, the size distribution of IMC grains shows good agreement with the FDR model. However, for SnPb/poly-Cu, during the solid-state aging procedure, the mean radius of the IMC grains was proportional to the cube root of the aging time. And the size distribution of IMC grains is well consistent with the FDR model. (C) 2011 Elsevier B.V. All rights reserved.
关键词	Intermetallic compounds Nucleation Interface EBSD
资助者	National Basic Research Program of China ; National Outstanding Young Scientist Foundation
DOI	10.1016/j.matchemphys.2011.08.061
收录类别	SCI
语种	英语
资助项目	National Basic Research Program of China[2010CB631006] ; National Outstanding Young Scientist Foundation[50625103]
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:000298764800032
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：20[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/104177
专题	中国科学院金属研究所
通讯作者	Zhang, Z. F.
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Capital Aerosp Machinery Co, Beijing 100076, Peoples R China
推荐引用方式 GB/T 7714	Zou, H. F.,Yang, H. J.,Zhang, Z. F.. Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders[J]. MATERIALS CHEMISTRY AND PHYSICS,2011,131(1-2):190-198.
APA	Zou, H. F.,Yang, H. J.,&Zhang, Z. F..(2011).Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders.MATERIALS CHEMISTRY AND PHYSICS,131(1-2),190-198.
MLA	Zou, H. F.,et al."Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders".MATERIALS CHEMISTRY AND PHYSICS 131.1-2(2011):190-198.