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STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING
Wang Ming1,2; Zhang Bin2; Liu Changsheng2; Zhang Guangping1
Corresponding AuthorZhang Guangping(gpzhang@imr.ac.cn)
2011-05-11
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume47Issue:5Pages:601-604
AbstractMetallization interconnects in microelectronic integrated circuits usually fail during fabrication and long term service under electrical, mechanical, or thermal field and coupled multi field of them, such as electromigration (EM) failure induced by direct current, stress induced voiding (SIV) damage and thermal fatigue under thermal cyclic strain, which affect the reliability of the interconnects. Although EM and SIV have been actively investigated for several decades, there is limited work on thermal cyclic strain induced thermal fatigue behaviors of thin metal films, which are becoming a more and more important reliability issue. In this work, the failure behavior of the 200 nm-thick Au thin films was studied through applying thermal cyclic strain generated by alternating current. The total thermal cyclic strain was determined from the temperature distribution along the Au line with a width of 6 p,m according to the experiment measurement and theoretical calculation. It was found that the grain size in the Au thin films increased inhomogenously and the damage along grain boundaries resulted in the fatal failure of the Au line in the condition of Delta epsilon <= 0.35% after 5x 10(6) cyc. Based on the experimental observations, thermal fatigue and mechanical fatigue failure behaviors were analyzed comparatively, and the basic mechanisms were discussed.
Keywordgold film alternating current thermal fatigue
DOI10.3724/SP.J.1037.2010.00668
Indexed BySCI
Language英语
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000291845800014
PublisherSCIENCE CHINA PRESS
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/104886
Collection中国科学院金属研究所
Corresponding AuthorZhang Guangping
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Northeastern Univ, Key Lab Anisotropy & Texture Mat, Minist Educ, Sch Met & Mat, Shenyang 110819, Peoples R China
Recommended Citation
GB/T 7714
Wang Ming,Zhang Bin,Liu Changsheng,et al. STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING[J]. ACTA METALLURGICA SINICA,2011,47(5):601-604.
APA Wang Ming,Zhang Bin,Liu Changsheng,&Zhang Guangping.(2011).STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING.ACTA METALLURGICA SINICA,47(5),601-604.
MLA Wang Ming,et al."STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING".ACTA METALLURGICA SINICA 47.5(2011):601-604.
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