STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING

doi:10.3724/SP.J.1037.2010.00668

IMR OpenIR

	STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING
	Wang Ming 1,2; Zhang Bin 2; Liu Changsheng 2; Zhang Guangping 1
通讯作者	Zhang Guangping(gpzhang@imr.ac.cn)
	2011-05-11
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	47 期号:5 页码:601-604
摘要	Metallization interconnects in microelectronic integrated circuits usually fail during fabrication and long term service under electrical, mechanical, or thermal field and coupled multi field of them, such as electromigration (EM) failure induced by direct current, stress induced voiding (SIV) damage and thermal fatigue under thermal cyclic strain, which affect the reliability of the interconnects. Although EM and SIV have been actively investigated for several decades, there is limited work on thermal cyclic strain induced thermal fatigue behaviors of thin metal films, which are becoming a more and more important reliability issue. In this work, the failure behavior of the 200 nm-thick Au thin films was studied through applying thermal cyclic strain generated by alternating current. The total thermal cyclic strain was determined from the temperature distribution along the Au line with a width of 6 p,m according to the experiment measurement and theoretical calculation. It was found that the grain size in the Au thin films increased inhomogenously and the damage along grain boundaries resulted in the fatal failure of the Au line in the condition of Delta epsilon <= 0.35% after 5x 10(6) cyc. Based on the experimental observations, thermal fatigue and mechanical fatigue failure behaviors were analyzed comparatively, and the basic mechanisms were discussed.
关键词	gold film alternating current thermal fatigue
DOI	10.3724/SP.J.1037.2010.00668
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000291845800014
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/104886
专题	中国科学院金属研究所
通讯作者	Zhang Guangping
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Northeastern Univ, Key Lab Anisotropy & Texture Mat, Minist Educ, Sch Met & Mat, Shenyang 110819, Peoples R China
推荐引用方式 GB/T 7714	Wang Ming,Zhang Bin,Liu Changsheng,et al. STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING[J]. ACTA METALLURGICA SINICA,2011,47(5):601-604.
APA	Wang Ming,Zhang Bin,Liu Changsheng,&Zhang Guangping.(2011).STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING.ACTA METALLURGICA SINICA,47(5),601-604.
MLA	Wang Ming,et al."STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING".ACTA METALLURGICA SINICA 47.5(2011):601-604.