Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites

doi:10.1016/j.msea.2010.10.075

IMR OpenIR

	Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites
	Jin, P.; Xiao, B. L.; Wang, Q. Z.; Ma, Z. Y.; Liu, Y.; Li, S.
通讯作者	Ma, Z. Y.(zyma@imr.ac.cn)
	2011-01-25
发表期刊	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN	0921-5093
卷号	528 期号:3 页码:1504-1511
摘要	In this study, the effect of solution temperature on artificial aging kinetics of 15 vol.% SiC particles reinforced 2009Al (SiCp/2009Al) composite prepared using a powder metallurgy method was investigated by means of microstructural examinations, hardness measurement and DSC analyses. The study indicated that, with increasing the solution temperature from 495 to 560 degrees C, while the GP zone formation and dissolution were retarded due to the decreased quenched-in vacancy concentration, the S' precipitation was promoted due to the increased dislocation density. This accelerated the aging kinetics of the composite with increasing the solution temperature from 495 to 560 degrees C. Furthermore, the composite which was solutionized at 530 degrees C exhibited the highest peak hardness and tensile strength. The effect of the solution temperature on the aging behavior and tensile properties of the composite was explained in terms of the variation of the microstructual mechanisms. (C) 2010 Elsevier B.V. All rights reserved.
关键词	Composites Aluminum alloys Aging Powder metallurgy Solution-treatment
DOI	10.1016/j.msea.2010.10.075
收录类别	SCI
语种	英语
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000286904300103
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：67[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/106749
专题	中国科学院金属研究所
通讯作者	Ma, Z. Y.
作者单位	Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Jin, P.,Xiao, B. L.,Wang, Q. Z.,et al. Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2011,528(3):1504-1511.
APA	Jin, P.,Xiao, B. L.,Wang, Q. Z.,Ma, Z. Y.,Liu, Y.,&Li, S..(2011).Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,528(3),1504-1511.
MLA	Jin, P.,et al."Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 528.3(2011):1504-1511.