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The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials
Wang, YP; Ding, BJ
Corresponding AuthorWang, YP()
1999-09-01
Source PublicationIEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN1521-3331
Volume22Issue:3Pages:467-472
AbstractThe microcrystalline and nanocrystalline CuCr alloys prepared by high-energy ball milling and hot pressing were investigated in this paper. The experimental results show that the nanocrystalline Cu-Cr alloy powders are obtained by high energy ball milling, and the milled powders appear flaked or equiaxed morphology with or without liquid medium addition. The grain size of near fully dense alloys consolidated at 850 and 1200 K from milled powders is less than 100 nm and about 2-3 mu m, respectively. The ability to withstand high voltage of the nanocrystalline CuCr materials in vacuum is much higher than that of microcrystalline materials. The breakdown first takes place on the Cu-rich phase in the microcrystalline CuCr materials. For nanocrystalline CuCr materials, the breakdown exhibits diffusional feature, in which the are can move to the whole contact surface in a breakdown.
KeywordCuCr contacts microcrystalline nanocrystalline voltage withstand
Indexed BySCI
Language英语
WOS Research AreaEngineering ; Materials Science
WOS SubjectEngineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS IDWOS:000083329100019
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation statistics
Cited Times:86[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/108865
Collection中国科学院金属研究所
Corresponding AuthorWang, YP
Affiliation1.Chinese Acad Sci, Inst Met Res, State Key Lab Rapidly Solidified NonEquilibrium A, Beijing, Peoples R China
2.Xian Jiao Tong Univ, State Key Lab Mech Behav Mat, Shanxi 710049, Peoples R China
Recommended Citation
GB/T 7714
Wang, YP,Ding, BJ. The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,1999,22(3):467-472.
APA Wang, YP,&Ding, BJ.(1999).The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,22(3),467-472.
MLA Wang, YP,et al."The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials".IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 22.3(1999):467-472.
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