Phase selection in magnetron sputter-deposited TiAl alloy

IMR OpenIR

	Phase selection in magnetron sputter-deposited TiAl alloy
	Wang, SZ ; Shao, G ; Tsakiropoulos, P ; Wang, F
通讯作者	Shao, G()
	2002-06-01
发表期刊	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN	0921-5093
卷号	329 页码:141-146
摘要	Microstructural evolution in an amorphous Ti-50 at.% Al deposit, which was produced by magnetron sputter deposition, has been studied. At low temperatures the alpha phase and hence the alpha(2) phase preceded the equilibrium gamma phase during isothermal annealing. Phase selection during annealing of the amorphous film is discussed using thermodynamic modelling and nucleation theory. (C) 2002 Elsevier Science B.V. All rights reserved.
关键词	TiAl sputter deposition metallic glass devitrification phase selection
收录类别	SCI
语种	英语
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000176762600022
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：19[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/113741
专题	中国科学院金属研究所
通讯作者	Shao, G
作者单位	1.Univ Surrey, Sch Mech & Mat Engn, Guildford GU2 7XH, Surrey, England 2.Acad Sinica, Inst Corros & Protect Met, Shenyang 110015, Peoples R China
推荐引用方式 GB/T 7714	Wang, SZ,Shao, G,Tsakiropoulos, P,et al. Phase selection in magnetron sputter-deposited TiAl alloy[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2002,329:141-146.
APA	Wang, SZ,Shao, G,Tsakiropoulos, P,&Wang, F.(2002).Phase selection in magnetron sputter-deposited TiAl alloy.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,329,141-146.
MLA	Wang, SZ,et al."Phase selection in magnetron sputter-deposited TiAl alloy".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 329(2002):141-146.