Greep behavior and microscopic mechanism of Mg-Y-Nd alloy | |
Sha, GY; Han, EH; Yu, T; Xu, YB; Liu, L; Gao, CZ | |
通讯作者 | Sha, GY() |
2003-10-01 | |
发表期刊 | ACTA METALLURGICA SINICA
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ISSN | 0412-1961 |
卷号 | 39期号:10页码:1025-1030 |
摘要 | The compress creep tests of the cast Mg-Y-Nd alloy were carried out at constant stress on Mayes fatigue machine in air. The results show that the creep resistance of the Mg-Y-Nd alloy is much higher when the temperature is lower than 300 degreesC for stress of 100 MPa, especially the steady creep rate at 200 degreesC decreases about three orders of magnitude than those of the Mg-Zn-Ce alloy and common AZ80 and AM60 alloys. Slipping and twinning are the fundamental modes of creep deformation for the alloy, the beta phases and dynamic precipitations during creep are the principal strengthening mechanism of the alloy, whereas the main reason for the decrease of the creep resistance is attributed to occurrence of the MgO particles at the interface between alpha-Mg matrix and beta phase, dynamic recrystallization as well as the fracture of the primary beta phases. |
关键词 | Mg-Y-Nd alloy creep precipitation strengthening MgO particle |
收录类别 | SCI |
语种 | 英语 |
WOS研究方向 | Metallurgy & Metallurgical Engineering |
WOS类目 | Metallurgy & Metallurgical Engineering |
WOS记录号 | WOS:000186451300003 |
出版者 | SCIENCE CHINA PRESS |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/116022 |
专题 | 中国科学院金属研究所 |
通讯作者 | Sha, GY |
作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Harbin Engn Univ, Sch Mech Engn, Harbin 150001, Peoples R China |
推荐引用方式 GB/T 7714 | Sha, GY,Han, EH,Yu, T,et al. Greep behavior and microscopic mechanism of Mg-Y-Nd alloy[J]. ACTA METALLURGICA SINICA,2003,39(10):1025-1030. |
APA | Sha, GY,Han, EH,Yu, T,Xu, YB,Liu, L,&Gao, CZ.(2003).Greep behavior and microscopic mechanism of Mg-Y-Nd alloy.ACTA METALLURGICA SINICA,39(10),1025-1030. |
MLA | Sha, GY,et al."Greep behavior and microscopic mechanism of Mg-Y-Nd alloy".ACTA METALLURGICA SINICA 39.10(2003):1025-1030. |
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