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Modeling and simulation of the microstructure evolution of the gas-atomized alloy droplets during spray forming
Zhao, JH; Liu, DM; Ye, HQ
Corresponding AuthorZhao, JH()
2003-09-01
Source PublicationJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
Volume19Issue:5Pages:398-402
AbstractIn order to understand the solidification process of an atomized droplet and predict the fraction solidification of droplets with flight distance during spray forming, a numerical model based on the population dynamics approach is developed to describe the microstructure evolution under the common action of the nucleation and growth of grains. The model is coupled with droplets heat transfer controlling equations and solved for Al-4.5 wt pct Cu alloy. It is demonstrated that the numerical results describe the solidification process well.
Keywordrapid solidification microstructure evolution modeling spray forming
Indexed BySCI
Language英语
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000185818700005
PublisherJOURNAL MATER SCI TECHNOL
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/116058
Collection中国科学院金属研究所
Corresponding AuthorZhao, JH
AffiliationChinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Zhao, JH,Liu, DM,Ye, HQ. Modeling and simulation of the microstructure evolution of the gas-atomized alloy droplets during spray forming[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2003,19(5):398-402.
APA Zhao, JH,Liu, DM,&Ye, HQ.(2003).Modeling and simulation of the microstructure evolution of the gas-atomized alloy droplets during spray forming.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,19(5),398-402.
MLA Zhao, JH,et al."Modeling and simulation of the microstructure evolution of the gas-atomized alloy droplets during spray forming".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 19.5(2003):398-402.
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