| Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate | |
| Qin, M; Ji, V; Li, JB; Ma, SY; Chen, CR; Song, ZX; He, JW | |
| Corresponding Author | Qin, M(mqin@imr.ac.cn) |
| 2004-07-01 | |
| Source Publication | ACTA METALLURGICA SINICA
 |
| ISSN | 0412-1961 |
| Volume | 40Issue:7Pages:716-720 |
| Abstract | Using X-ray tensile test, the relationship between the yield strength and annealing temperature for a Cu film with biaxial residual stress adherent to substrate was investigated. The results indicate that the proof stress of the film decreases with increasing annealing temperature. When annealing temperature rose from 150 degreesC to 300 degreesC, the decreasing amplitude of proof stress is the largest. The reason of this phenomenon is that recrystallization in film occurred at 300 degreesC, and a majority of structure strengthening effects disappeared. The yield strength of the Cu film on the steel substrate is greatly higher than that of block Cu. |
| Keyword | Cu film biaxial stress yield strength annealing temperature X-ray tensile test |
| Indexed By | SCI |
| Language | 英语 |
| WOS Research Area | Metallurgy & Metallurgical Engineering |
| WOS Subject | Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000222938000008 |
| Publisher | SCIENCE CHINA PRESS |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/119690 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Qin, M |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Ecole Natl Super Arts & Metiers, LM3 ESA CNRS 8006, F-75013 Paris, France 3.Xian Jiaotong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China |
| Recommended Citation GB/T 7714 | Qin, M,Ji, V,Li, JB,et al. Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate[J]. ACTA METALLURGICA SINICA,2004,40(7):716-720. |
| APA | Qin, M.,Ji, V.,Li, JB.,Ma, SY.,Chen, CR.,...&He, JW.(2004).Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate.ACTA METALLURGICA SINICA,40(7),716-720. |
| MLA | Qin, M,et al."Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate".ACTA METALLURGICA SINICA 40.7(2004):716-720. |
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