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Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate
Qin, M; Ji, V; Li, JB; Ma, SY; Chen, CR; Song, ZX; He, JW
Corresponding AuthorQin, M(mqin@imr.ac.cn)
2004-07-01
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume40Issue:7Pages:716-720
AbstractUsing X-ray tensile test, the relationship between the yield strength and annealing temperature for a Cu film with biaxial residual stress adherent to substrate was investigated. The results indicate that the proof stress of the film decreases with increasing annealing temperature. When annealing temperature rose from 150 degreesC to 300 degreesC, the decreasing amplitude of proof stress is the largest. The reason of this phenomenon is that recrystallization in film occurred at 300 degreesC, and a majority of structure strengthening effects disappeared. The yield strength of the Cu film on the steel substrate is greatly higher than that of block Cu.
KeywordCu film biaxial stress yield strength annealing temperature X-ray tensile test
Indexed BySCI
Language英语
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000222938000008
PublisherSCIENCE CHINA PRESS
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/119690
Collection中国科学院金属研究所
Corresponding AuthorQin, M
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Ecole Natl Super Arts & Metiers, LM3 ESA CNRS 8006, F-75013 Paris, France
3.Xian Jiaotong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
Recommended Citation
GB/T 7714
Qin, M,Ji, V,Li, JB,et al. Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate[J]. ACTA METALLURGICA SINICA,2004,40(7):716-720.
APA Qin, M.,Ji, V.,Li, JB.,Ma, SY.,Chen, CR.,...&He, JW.(2004).Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate.ACTA METALLURGICA SINICA,40(7),716-720.
MLA Qin, M,et al."Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate".ACTA METALLURGICA SINICA 40.7(2004):716-720.
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