Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating

IMR OpenIR

	Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating
	Li, F ; Liu, CZ ; Xian, AP ; Shang, JK
通讯作者	Xian, AP()
	2004-08-01
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	40 期号:8 页码:815-821
摘要	Interfacial reactions between eutectic Sn-58Bi lead-free solder and Cu or electroless Ni-P plating were studied. The joining temperature was 180 degreesC, the aging temperature was 60120 degreesC, and the aging time was 5 to 30 d. The interfacial reaction products determined by SEM, EDAX and XRD are Cu6Sn5 on the solder/Cu interface, and Ni3Sn4 on the solder/Ni-P interface. In addition, there is a P-rich layer between Ni3Sn4 and Ni.layer. The growth rate Of Cu6Sn5 is much faster than that of Ni3Sn4. The growth rate of Ni3Sn4 was found to decrease with increasing P content in the electroless Ni-P plating. The kinetics of the intermetallic compound growth follows a parabolic law of time, as controlled by the diffusion mechanism. The apparent activation energies are 90.87 kJ/mol for the growth Of Cu6Sn5, 101.43 kJ/mol for Ni3Sn4 on Ni-9%P plating and 117.31 kJ/mol for Ni3Sn4 On Ni-16%P plate, respectively.
关键词	Sn-Bi alloy lead-free solder interfacial reaction intermetallic compound electroless Ni-P plating
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000223695400007
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：6[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/119785
专题	中国科学院金属研究所
通讯作者	Xian, AP
作者单位	1.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Li, F,Liu, CZ,Xian, AP,et al. Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating[J]. ACTA METALLURGICA SINICA,2004,40(8):815-821.
APA	Li, F,Liu, CZ,Xian, AP,&Shang, JK.(2004).Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating.ACTA METALLURGICA SINICA,40(8),815-821.
MLA	Li, F,et al."Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating".ACTA METALLURGICA SINICA 40.8(2004):815-821.