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Properties and Microstructures of Sn-Bi-X Lead-Free Solders
Yang, Fan1; Zhang, Liang1,2; Liu, Zhi-quan2; Zhong, Su-juan3; Ma, Jia3; Bao, Li3
Corresponding AuthorZhang, Liang(zhangliang@jsnu.edu.cn)
2016
Source PublicationADVANCES IN MATERIALS SCIENCE AND ENGINEERING
ISSN1687-8434
Pages15
AbstractThe Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139 degrees C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.
Funding OrganizationResearch Innovation Project for College Graduate of Jiangsu Province ; Natural Science Foundation of China ; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering) ; Six Kind Skilled Personnel Project of Jiangsu Province ; Qing Lan Project ; High Level Talent Plan of Jiangsu Normal University ; Jiangsu Normal University
DOI10.1155/2016/9265195
Indexed BySCI
Language英语
Funding ProjectResearch Innovation Project for College Graduate of Jiangsu Province[KYZZ16_0469] ; Natural Science Foundation of China[51475220] ; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering)[SKLABFMT-2015-03] ; Six Kind Skilled Personnel Project of Jiangsu Province[XCL-022] ; Qing Lan Project ; High Level Talent Plan of Jiangsu Normal University[YQ2015002] ; Jiangsu Normal University
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000392086400001
PublisherHINDAWI PUBLISHING CORP
Citation statistics
Cited Times:13[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/123661
Collection中国科学院金属研究所
Corresponding AuthorZhang, Liang
Affiliation1.Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
3.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou 450001, Peoples R China
Recommended Citation
GB/T 7714
Yang, Fan,Zhang, Liang,Liu, Zhi-quan,et al. Properties and Microstructures of Sn-Bi-X Lead-Free Solders[J]. ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,2016:15.
APA Yang, Fan,Zhang, Liang,Liu, Zhi-quan,Zhong, Su-juan,Ma, Jia,&Bao, Li.(2016).Properties and Microstructures of Sn-Bi-X Lead-Free Solders.ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,15.
MLA Yang, Fan,et al."Properties and Microstructures of Sn-Bi-X Lead-Free Solders".ADVANCES IN MATERIALS SCIENCE AND ENGINEERING (2016):15.
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