| Properties and Microstructures of Sn-Bi-X Lead-Free Solders | |
| Yang, Fan1; Zhang, Liang1,2; Liu, Zhi-quan2; Zhong, Su-juan3; Ma, Jia3; Bao, Li3 | |
| Corresponding Author | Zhang, Liang(zhangliang@jsnu.edu.cn) |
| 2016 | |
| Source Publication | ADVANCES IN MATERIALS SCIENCE AND ENGINEERING
 |
| ISSN | 1687-8434 |
| Pages | 15 |
| Abstract | The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139 degrees C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders. |
| Funding Organization | Research Innovation Project for College Graduate of Jiangsu Province ; Natural Science Foundation of China ; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering) ; Six Kind Skilled Personnel Project of Jiangsu Province ; Qing Lan Project ; High Level Talent Plan of Jiangsu Normal University ; Jiangsu Normal University |
| DOI | 10.1155/2016/9265195 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | Research Innovation Project for College Graduate of Jiangsu Province[KYZZ16_0469] ; Natural Science Foundation of China[51475220] ; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering)[SKLABFMT-2015-03] ; Six Kind Skilled Personnel Project of Jiangsu Province[XCL-022] ; Qing Lan Project ; High Level Talent Plan of Jiangsu Normal University[YQ2015002] ; Jiangsu Normal University |
| WOS Research Area | Materials Science |
| WOS Subject | Materials Science, Multidisciplinary |
| WOS ID | WOS:000392086400001 |
| Publisher | HINDAWI PUBLISHING CORP |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/123661 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhang, Liang |
| Affiliation | 1.Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 3.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou 450001, Peoples R China |
| Recommended Citation GB/T 7714 | Yang, Fan,Zhang, Liang,Liu, Zhi-quan,et al. Properties and Microstructures of Sn-Bi-X Lead-Free Solders[J]. ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,2016:15. |
| APA | Yang, Fan,Zhang, Liang,Liu, Zhi-quan,Zhong, Su-juan,Ma, Jia,&Bao, Li.(2016).Properties and Microstructures of Sn-Bi-X Lead-Free Solders.ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,15. |
| MLA | Yang, Fan,et al."Properties and Microstructures of Sn-Bi-X Lead-Free Solders".ADVANCES IN MATERIALS SCIENCE AND ENGINEERING (2016):15. |
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