Preparation and Activation Mechanism of Pd Colloid with High Concentration and Performance

doi:10.11900/0412.1961.2016.00388

IMR OpenIR

	Preparation and Activation Mechanism of Pd Colloid with High Concentration and Performance
	Qu Shuoshuo 1,2; Zhu Qingsheng 2; Gong Yadong 1; Yang Yuying 1; Li Caifu 2; Gao Shian 2
通讯作者	Zhu Qingsheng(qszhu@imr.ac.cn)
	2017-04-11
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	53 期号:4 页码:487-493
摘要	The non-conductive substrate is often metallized through electroless plating method. Prior to the electroless plating, the substrate surfaces need to be firstly Pd activation pre-treated. The traditional "two-step" activation process, i.e., sensitization-activation, has been gradually obsoleted because of poor controllability and uniformity. A "one-step" activation process using Pd colloid has been widely used in industry, especially for the microvia metallization treatment in printed circuit board (PCB) fabrication. The bottleneck problem of this technology is the preparation of the Pd colloid solution with high concentration and excellent catalytic activity. The aim of this work is to develop a preparation method of the Pd colloid with high concentration and high quality. Pd colloid was prepared by a continuous reduction reaction with minor content. By mean of this process, the Pd concentration of the prepared colloid can exceed 2%. The morphology, microstructure and composition of the Pd colloid were characterized by SEM, TEM, XRD and XPS, respectively. The activate ability of the Pd colloid was examined by electroless Cu and electrochemical test. It was found that the average diameter of the Pd particles was less than 4 nm. Even if the concentration of Pd was less than 25 mg/L, this Pd colloid still had good activation ability for electro-less Cu. The result demonstrated that the shell structure of the Pd micelle played a key role for the activation ability. The shell of Pd micelle was consisted of Sn2+, Sn4+ and Cl-, and generally formed two structures, [PdSn2]Cl-6 and [PdSn3]Cl-8. For the structure of [PdSn3]Cl-8, the failure of the hydrolysis could lead to the loss of activation. The preparation method in this work can effectively avoid the occurrence of [PdSn3]Cl-8, which greatly improved the activation ability of the Pd colloid.
关键词	Pd colloidal electroless Cu activation
资助者	National Natural Science Foundation of China ; Science and Technology Program of Shenyang
DOI	10.11900/0412.1961.2016.00388
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[51471180] ; Science and Technology Program of Shenyang[F16-205-1-18]
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000399921900013
出版者	SCIENCE PRESS
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/124656
专题	中国科学院金属研究所
通讯作者	Zhu Qingsheng
作者单位	1.Northeastern Univ, Sch Mech Engn & Automat, Shenyang 110819, Peoples R China 2.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Qu Shuoshuo,Zhu Qingsheng,Gong Yadong,et al. Preparation and Activation Mechanism of Pd Colloid with High Concentration and Performance[J]. ACTA METALLURGICA SINICA,2017,53(4):487-493.
APA	Qu Shuoshuo,Zhu Qingsheng,Gong Yadong,Yang Yuying,Li Caifu,&Gao Shian.(2017).Preparation and Activation Mechanism of Pd Colloid with High Concentration and Performance.ACTA METALLURGICA SINICA,53(4),487-493.
MLA	Qu Shuoshuo,et al."Preparation and Activation Mechanism of Pd Colloid with High Concentration and Performance".ACTA METALLURGICA SINICA 53.4(2017):487-493.