| Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors | |
| Zhang Guangping1; Chen Honglei1,2; Luo Xuemei1; Zhang Bin3 | |
| Corresponding Author | Zhang Guangping(gpzhang@imr.ac.cn) |
| 2018-03-11 | |
| Source Publication | ACTA METALLURGICA SINICA
 |
| ISSN | 0412-1961 |
| Volume | 54Issue:3Pages:357-366 |
| Abstract | The world has gradually entered the industrial 4.0 Era, which is dominated by the Internet of Things (IOT) and intelligent manufacturing. Especially, strong requirement for artificial intelligence and big data processing, the development and preparation of micro/nano electronic devices is becoming increasingly active, and much more concerns have been attracted to small-scale materials. Because of the constraint effect of geometric and microstructural dimensions of these materials, the thermal fatigue damage behavior is different from that of the bulk counterparts. At the same time, the change of the material scale from microns to nanometers also results in the transformation of the deformation mechanism, so that the materials exhibit different damage behaviors and significant size effects. In this paper, thermal fatigue testing methods, thermal fatigue damage and evolution, and the factors influencing thermal fatigue properties of metal film/line are reviewed, the corresponding mechanism of thermal fatigue and the size effect of the micro/nano-scale metals are discussed. The prospective research of this field in the future is addressed. |
| Keyword | thin metal film interconnect alternating current thermal fatigue size effect |
| Funding Organization | National Natural Science Foundation of China |
| DOI | 10.11900/0412.1961.2017.00371 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Natural Science Foundation of China[51371047] ; National Natural Science Foundation of China[51671050] ; National Natural Science Foundation of China[51601198] |
| WOS Research Area | Metallurgy & Metallurgical Engineering |
| WOS Subject | Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000427121400001 |
| Publisher | SCIENCE PRESS |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/127494 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhang Guangping |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China 3.Northeastern Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Anisotropy & Texture Mat, Shenyang 110819, Liaoning, Peoples R China |
| Recommended Citation GB/T 7714 | Zhang Guangping,Chen Honglei,Luo Xuemei,et al. Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors[J]. ACTA METALLURGICA SINICA,2018,54(3):357-366. |
| APA | Zhang Guangping,Chen Honglei,Luo Xuemei,&Zhang Bin.(2018).Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors.ACTA METALLURGICA SINICA,54(3),357-366. |
| MLA | Zhang Guangping,et al."Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors".ACTA METALLURGICA SINICA 54.3(2018):357-366. |
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