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Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation
Zhu, Y. K.1; Chen, Q. Y.2; Wang, Q.1; Yu, H. Y.2; Li, R.2; Hou, J. P.1; Zhang, Z. J.1; Zhang, G. P.1; Zhang, Z. F.1
Corresponding AuthorWang, Q.(gmwang@imr.ac.cn)
2018-07-01
Source PublicationJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
Volume34Issue:7Pages:1214-1221
AbstractThe evolution of microstructure in the drawing process of commercially pure aluminum wire (CPAW) does not only depend on the nature of materials, but also on the stress profile. In this study, the effect of stress profile on the texture evolution of the CPAW was systematically investigated by combining the numerical simulation and the microstructure observation. The results show that the tensile stress at the wire center promotes the formation of <111> texture, whereas the shear stress nearby the rim makes little contribution to the texture formation. Therefore, the <111> texture at the wire center is stronger than that in the surface layer, which also results in a higher microhardness at the center of the CPAW under axial loading. (C) 2017 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
KeywordCommercially pure aluminum wire Cold drawing Texture Finite element simulation Stress profile
Funding OrganizationState Grid Corporation of China ; National Natural Science Foundation of China
DOI10.1016/j.jmst.2017.07.011
Indexed BySCI
Language英语
Funding ProjectState Grid Corporation of China[52110416001z] ; National Natural Science Foundation of China[51331007]
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000434132800019
PublisherJOURNAL MATER SCI TECHNOL
Citation statistics
Cited Times:23[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/128177
Collection中国科学院金属研究所
Corresponding AuthorWang, Q.
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China
2.Zhejiang Huadian Equipment Testing Inst, Natl Qual Supervis & Inspect Ctr Elect Equipment, Hangzhou 310015, Zhejiang, Peoples R China
Recommended Citation
GB/T 7714
Zhu, Y. K.,Chen, Q. Y.,Wang, Q.,et al. Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2018,34(7):1214-1221.
APA Zhu, Y. K..,Chen, Q. Y..,Wang, Q..,Yu, H. Y..,Li, R..,...&Zhang, Z. F..(2018).Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,34(7),1214-1221.
MLA Zhu, Y. K.,et al."Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 34.7(2018):1214-1221.
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