Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation | |
Zhu, Y. K.1; Chen, Q. Y.2; Wang, Q.1; Yu, H. Y.2; Li, R.2; Hou, J. P.1; Zhang, Z. J.1; Zhang, G. P.1; Zhang, Z. F.1 | |
Corresponding Author | Wang, Q.(gmwang@imr.ac.cn) |
2018-07-01 | |
Source Publication | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
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ISSN | 1005-0302 |
Volume | 34Issue:7Pages:1214-1221 |
Abstract | The evolution of microstructure in the drawing process of commercially pure aluminum wire (CPAW) does not only depend on the nature of materials, but also on the stress profile. In this study, the effect of stress profile on the texture evolution of the CPAW was systematically investigated by combining the numerical simulation and the microstructure observation. The results show that the tensile stress at the wire center promotes the formation of <111> texture, whereas the shear stress nearby the rim makes little contribution to the texture formation. Therefore, the <111> texture at the wire center is stronger than that in the surface layer, which also results in a higher microhardness at the center of the CPAW under axial loading. (C) 2017 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology. |
Keyword | Commercially pure aluminum wire Cold drawing Texture Finite element simulation Stress profile |
Funding Organization | State Grid Corporation of China ; National Natural Science Foundation of China |
DOI | 10.1016/j.jmst.2017.07.011 |
Indexed By | SCI |
Language | 英语 |
Funding Project | State Grid Corporation of China[52110416001z] ; National Natural Science Foundation of China[51331007] |
WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering |
WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS ID | WOS:000434132800019 |
Publisher | JOURNAL MATER SCI TECHNOL |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/128177 |
Collection | 中国科学院金属研究所 |
Corresponding Author | Wang, Q. |
Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China 2.Zhejiang Huadian Equipment Testing Inst, Natl Qual Supervis & Inspect Ctr Elect Equipment, Hangzhou 310015, Zhejiang, Peoples R China |
Recommended Citation GB/T 7714 | Zhu, Y. K.,Chen, Q. Y.,Wang, Q.,et al. Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2018,34(7):1214-1221. |
APA | Zhu, Y. K..,Chen, Q. Y..,Wang, Q..,Yu, H. Y..,Li, R..,...&Zhang, Z. F..(2018).Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,34(7),1214-1221. |
MLA | Zhu, Y. K.,et al."Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 34.7(2018):1214-1221. |
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