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A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride
Tian, Zhilin1; Sun, Jiajia2; Wang, Shaogang3; Zeng, Xiaoliang2; Zhou, Shuang1; Bai, Shulin4; Zhao, Ni1; Wong, Ching-Ping1,5
Corresponding AuthorZhao, Ni(nzhao@ee.cuhk.edu.hk) ; Wong, Ching-Ping(cpwong@cuhk.edu.hk)
2018-09-28
Source PublicationJOURNAL OF MATERIALS CHEMISTRY A
ISSN2050-7488
Volume6Issue:36Pages:17540-17547
AbstractDeveloping thermal interface materials with high thermal conductivity and appropriate mechanical properties is of great significance for reliable operation and enhancing the lifetime of electronic devices. In this work, we developed a direct foaming method to fabricate a three dimensionally interconnected hierarchical porous boron nitride (BN)/epoxy composite for thermal interface material applications. The foam-templated approach allows for construction of an isotropic porous structure with low loading of fillers and is a versatile method that can be applied to various high-thermal conductivity fillers. Based on this method, we performed a comparative study on micron-size and submicron-size BN based thermal interface materials through combining structural, morphological and thermal property characterizations as well as defect analysis. The results demonstrate that, as compared to the submicron BN fillers, the micron BN fillers can form a better aligned distribution along the three dimensional network while introducing less defects and grain boundaries, resulting in high thermal conductivity both in-plane (5.19 W m(-1) K-1) and out-of-plane (3.48 W m(-1) K-1) at a low filler concentration of 24.4 wt%. This study provides guidelines on the design, fabrication and optimization of composite-based thermal interface materials.
Funding OrganizationNSFC/RGC Joint Research Scheme
DOI10.1039/c8ta05638b
Indexed BySCI
Language英语
Funding ProjectNSFC/RGC Joint Research Scheme[11272008] ; NSFC/RGC Joint Research Scheme[11361161001] ; NSFC/RGC Joint Research Scheme[CUHK450/13]
WOS Research AreaChemistry ; Energy & Fuels ; Materials Science
WOS SubjectChemistry, Physical ; Energy & Fuels ; Materials Science, Multidisciplinary
WOS IDWOS:000448147200031
PublisherROYAL SOC CHEMISTRY
Citation statistics
Cited Times:52[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/130140
Collection中国科学院金属研究所
Corresponding AuthorZhao, Ni; Wong, Ching-Ping
Affiliation1.Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China
2.Univ Chinese Acad Sci, Shenzhen Coll Adv Technol, Shenzhen 518055, Peoples R China
3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China
4.Peking Univ, Key Lab Polymer Chem & Phys, Dept Mat Sci & Engn, CAPT HEDPS,Minist Educ,Coll Engn, Beijing 100871, Peoples R China
5.Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
Recommended Citation
GB/T 7714
Tian, Zhilin,Sun, Jiajia,Wang, Shaogang,et al. A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride[J]. JOURNAL OF MATERIALS CHEMISTRY A,2018,6(36):17540-17547.
APA Tian, Zhilin.,Sun, Jiajia.,Wang, Shaogang.,Zeng, Xiaoliang.,Zhou, Shuang.,...&Wong, Ching-Ping.(2018).A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride.JOURNAL OF MATERIALS CHEMISTRY A,6(36),17540-17547.
MLA Tian, Zhilin,et al."A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride".JOURNAL OF MATERIALS CHEMISTRY A 6.36(2018):17540-17547.
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