A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride

doi:10.1039/c8ta05638b

IMR OpenIR

	A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride
	Tian, Zhilin 1; Sun, Jiajia 2; Wang, Shaogang 3; Zeng, Xiaoliang 2; Zhou, Shuang 1; Bai, Shulin 4; Zhao, Ni 1; Wong, Ching-Ping 1,5
通讯作者	Zhao, Ni(nzhao@ee.cuhk.edu.hk) ; Wong, Ching-Ping(cpwong@cuhk.edu.hk)
	2018-09-28
发表期刊	JOURNAL OF MATERIALS CHEMISTRY A
ISSN	2050-7488
卷号	6 期号:36 页码:17540-17547
摘要	Developing thermal interface materials with high thermal conductivity and appropriate mechanical properties is of great significance for reliable operation and enhancing the lifetime of electronic devices. In this work, we developed a direct foaming method to fabricate a three dimensionally interconnected hierarchical porous boron nitride (BN)/epoxy composite for thermal interface material applications. The foam-templated approach allows for construction of an isotropic porous structure with low loading of fillers and is a versatile method that can be applied to various high-thermal conductivity fillers. Based on this method, we performed a comparative study on micron-size and submicron-size BN based thermal interface materials through combining structural, morphological and thermal property characterizations as well as defect analysis. The results demonstrate that, as compared to the submicron BN fillers, the micron BN fillers can form a better aligned distribution along the three dimensional network while introducing less defects and grain boundaries, resulting in high thermal conductivity both in-plane (5.19 W m(-1) K-1) and out-of-plane (3.48 W m(-1) K-1) at a low filler concentration of 24.4 wt%. This study provides guidelines on the design, fabrication and optimization of composite-based thermal interface materials.
资助者	NSFC/RGC Joint Research Scheme
DOI	10.1039/c8ta05638b
收录类别	SCI
语种	英语
资助项目	NSFC/RGC Joint Research Scheme[11272008] ; NSFC/RGC Joint Research Scheme[11361161001] ; NSFC/RGC Joint Research Scheme[CUHK450/13]
WOS研究方向	Chemistry ; Energy & Fuels ; Materials Science
WOS类目	Chemistry, Physical ; Energy & Fuels ; Materials Science, Multidisciplinary
WOS记录号	WOS:000448147200031
出版者	ROYAL SOC CHEMISTRY
引用统计	被引频次：97[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/130140
专题	中国科学院金属研究所
通讯作者	Zhao, Ni; Wong, Ching-Ping
作者单位	1.Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China 2.Univ Chinese Acad Sci, Shenzhen Coll Adv Technol, Shenzhen 518055, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China 4.Peking Univ, Key Lab Polymer Chem & Phys, Dept Mat Sci & Engn, CAPT HEDPS,Minist Educ,Coll Engn, Beijing 100871, Peoples R China 5.Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
推荐引用方式 GB/T 7714	Tian, Zhilin,Sun, Jiajia,Wang, Shaogang,et al. A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride[J]. JOURNAL OF MATERIALS CHEMISTRY A,2018,6(36):17540-17547.
APA	Tian, Zhilin.,Sun, Jiajia.,Wang, Shaogang.,Zeng, Xiaoliang.,Zhou, Shuang.,...&Wong, Ching-Ping.(2018).A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride.JOURNAL OF MATERIALS CHEMISTRY A,6(36),17540-17547.
MLA	Tian, Zhilin,et al."A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride".JOURNAL OF MATERIALS CHEMISTRY A 6.36(2018):17540-17547.