| A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride | |
| Tian, Zhilin1; Sun, Jiajia2; Wang, Shaogang3; Zeng, Xiaoliang2; Zhou, Shuang1; Bai, Shulin4; Zhao, Ni1; Wong, Ching-Ping1,5 | |
| Corresponding Author | Zhao, Ni(nzhao@ee.cuhk.edu.hk) ; Wong, Ching-Ping(cpwong@cuhk.edu.hk) |
| 2018-09-28 | |
| Source Publication | JOURNAL OF MATERIALS CHEMISTRY A
 |
| ISSN | 2050-7488 |
| Volume | 6Issue:36Pages:17540-17547 |
| Abstract | Developing thermal interface materials with high thermal conductivity and appropriate mechanical properties is of great significance for reliable operation and enhancing the lifetime of electronic devices. In this work, we developed a direct foaming method to fabricate a three dimensionally interconnected hierarchical porous boron nitride (BN)/epoxy composite for thermal interface material applications. The foam-templated approach allows for construction of an isotropic porous structure with low loading of fillers and is a versatile method that can be applied to various high-thermal conductivity fillers. Based on this method, we performed a comparative study on micron-size and submicron-size BN based thermal interface materials through combining structural, morphological and thermal property characterizations as well as defect analysis. The results demonstrate that, as compared to the submicron BN fillers, the micron BN fillers can form a better aligned distribution along the three dimensional network while introducing less defects and grain boundaries, resulting in high thermal conductivity both in-plane (5.19 W m(-1) K-1) and out-of-plane (3.48 W m(-1) K-1) at a low filler concentration of 24.4 wt%. This study provides guidelines on the design, fabrication and optimization of composite-based thermal interface materials. |
| Funding Organization | NSFC/RGC Joint Research Scheme |
| DOI | 10.1039/c8ta05638b |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | NSFC/RGC Joint Research Scheme[11272008] ; NSFC/RGC Joint Research Scheme[11361161001] ; NSFC/RGC Joint Research Scheme[CUHK450/13] |
| WOS Research Area | Chemistry ; Energy & Fuels ; Materials Science |
| WOS Subject | Chemistry, Physical ; Energy & Fuels ; Materials Science, Multidisciplinary |
| WOS ID | WOS:000448147200031 |
| Publisher | ROYAL SOC CHEMISTRY |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/130140 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhao, Ni; Wong, Ching-Ping |
| Affiliation | 1.Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China 2.Univ Chinese Acad Sci, Shenzhen Coll Adv Technol, Shenzhen 518055, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China 4.Peking Univ, Key Lab Polymer Chem & Phys, Dept Mat Sci & Engn, CAPT HEDPS,Minist Educ,Coll Engn, Beijing 100871, Peoples R China 5.Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA |
| Recommended Citation GB/T 7714 | Tian, Zhilin,Sun, Jiajia,Wang, Shaogang,et al. A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride[J]. JOURNAL OF MATERIALS CHEMISTRY A,2018,6(36):17540-17547. |
| APA | Tian, Zhilin.,Sun, Jiajia.,Wang, Shaogang.,Zeng, Xiaoliang.,Zhou, Shuang.,...&Wong, Ching-Ping.(2018).A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride.JOURNAL OF MATERIALS CHEMISTRY A,6(36),17540-17547. |
| MLA | Tian, Zhilin,et al."A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride".JOURNAL OF MATERIALS CHEMISTRY A 6.36(2018):17540-17547. |
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