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Antibacterial TiCu/TiCuN Multilayer Films with Good Corrosion Resistance Deposited by Axial Magnetic Field-Enhanced Arc Ion Plating
Peng, Cong1,2; Zhao, Yanhui2; Jin, Shujing2; Wang, JingRen4; Liu, Rui2,3; Liu, Hui1,2; Shi, Wenbo1,2; Kolawole, Sharafadeen Kunle1,2; Ren, Ling2; Yu, Baohai2; Yang, Ke2
Corresponding AuthorRen, Ling(lren@imr.ac.cn)
2019-01-09
Source PublicationACS APPLIED MATERIALS & INTERFACES
ISSN1944-8244
Volume11Issue:1Pages:125-136
AbstractIn order to develop a novel kind of antibacterial Cu-containing TiN film with good corrosion resistance, impressive mechanical properties, and low cytotoxicity, three differently designed multilayer films of TiCu/TiCuN multilayer (M1, M2, M3) were deposited on the surface of 316L stainless steel surface using the axial magnetic field-enhanced arc ion plating (AMFE-ARP) method, in which the interlayer of TiCu was first introduced for Cu-containing TiN film in order to improve comprehensive properties, especially the corrosion resistance of the film. The performance of the TiCu/TiCuN multilayer films was compared with that of the two single layers, TiN and TiCuN, which were deposited by the same method and the same total deposition time. The results indicated that the TiCu/TiCuN multilayer film of M2 revealed the best comprehensive corrosion resistance with low electric current values, high pitting potential, and high polarization resistance due to the proper thickness of TiCu interlayers and larger number of TiCu/TiCuN bilayers. In addition, the TiCu/TiCuN multilayer film of M2 also possesses comparable mechanical properties, excellent antibacterial and antibiofilm abilities, as well as good biocompatibility. Consequently, the antibacterial TiCu/TiCuN multilayer films with good corrosion resistance deposited by using the axial magnetic field-enhanced arc ion plating (AMFE-ARP) method are promising for application in biomedical antibacterial film for implants.
KeywordTiCu/TiCuN multilayer coating arc ion plating antibacterial property corrosion resistance
Funding OrganizationNational Natural Science Foundation ; National Key Research and Development Program of China ; Natural Science Foundation of Guangdong province ; Innovation fund project of Institute of metal research, Chinese Academy of Sciences
DOI10.1021/acsami.8b14038
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation[51631009] ; National Key Research and Development Program of China[2016YFC1100600] ; Natural Science Foundation of Guangdong province[2015A030312004] ; Innovation fund project of Institute of metal research, Chinese Academy of Sciences[2017-ZD01]
WOS Research AreaScience & Technology - Other Topics ; Materials Science
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary
WOS IDWOS:000455561200016
PublisherAMER CHEMICAL SOC
Citation statistics
Cited Times:36[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/131221
Collection中国科学院金属研究所
Corresponding AuthorRen, Ling
Affiliation1.Univ Sci & Technol China, Sch Mat Sci Engn, Shenyang 110016, Liaoning, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
3.Northeastern Univ, 3-11 Wenhua Rd, Shenyang 110819, Liaoning, Peoples R China
4.China Med Univ, Sch Stomatol, Shenyang 110819, Liaoning, Peoples R China
Recommended Citation
GB/T 7714
Peng, Cong,Zhao, Yanhui,Jin, Shujing,et al. Antibacterial TiCu/TiCuN Multilayer Films with Good Corrosion Resistance Deposited by Axial Magnetic Field-Enhanced Arc Ion Plating[J]. ACS APPLIED MATERIALS & INTERFACES,2019,11(1):125-136.
APA Peng, Cong.,Zhao, Yanhui.,Jin, Shujing.,Wang, JingRen.,Liu, Rui.,...&Yang, Ke.(2019).Antibacterial TiCu/TiCuN Multilayer Films with Good Corrosion Resistance Deposited by Axial Magnetic Field-Enhanced Arc Ion Plating.ACS APPLIED MATERIALS & INTERFACES,11(1),125-136.
MLA Peng, Cong,et al."Antibacterial TiCu/TiCuN Multilayer Films with Good Corrosion Resistance Deposited by Axial Magnetic Field-Enhanced Arc Ion Plating".ACS APPLIED MATERIALS & INTERFACES 11.1(2019):125-136.
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