Evolution of the interfacial microstructure during the plastic deformation bonding of copper

doi:10.1016/j.msea.2018.12.119

IMR OpenIR

	Evolution of the interfacial microstructure during the plastic deformation bonding of copper
	Zhang, Jian Yang 1,2; Sun, Ming Yue 1,3,4; Xu, Bin 1,3,4; Hu, Xin 5; Liu, Sheng 1,2; Xie, Bi Jun 1,2; Li, Dian Zhong 1,3
通讯作者	Sun, Ming Yue(mysun@imr.ac.cn)
	2019-02-11
发表期刊	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN	0921-5093
卷号	746 页码:1-10
摘要	In order to clarify the bonding mechanism by plastic deformation of two similar materials, the microstructural evolution of the copper-copper interface by hot compression was investigated in detail. Particular attention was given to the development of new recrystallized grains in the bonding area and the elimination of the bonding line by the migration of interfacial grain boundaries (IGBs) during the hot compression process. The evolution of new grains in the matrix and the interface occur via different types of dynamic recrystallization (DRX). The former is associated with the grain boundary bulging and the latter is related to a strain induced substructure. This substructure is composed of a dislocation wall, and is transformed into recrystallized grain by the evolution of high angular misorientations after increasing strain. Two types of interfaces with different grain size features, such as a fine-fine grain or a fine-coarse grain interface, will be generated owing to different degrees of re crystallization occurring at the interface. The bonding mechanisms of the two different structural interfaces are also discussed.
关键词	Copper bonding Hot compression bonding Dynamic recrystallization Grain boundary Dislocation wall
资助者	National Key Research and Development Program ; National Natural Science Foundation of China ; Key Program of the Chinese Academy of Sciences
DOI	10.1016/j.msea.2018.12.119
收录类别	SCI
语种	英语
资助项目	National Key Research and Development Program[2016YFB0300401] ; National Natural Science Foundation of China[U1508215] ; National Natural Science Foundation of China[51774265] ; Key Program of the Chinese Academy of Sciences[ZDRW-CN-2017-1]
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000458227900001
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：35[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/131520
专题	中国科学院金属研究所
通讯作者	Sun, Ming Yue
作者单位	1.Chinese Acad Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China 3.Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China 4.Chinese Acad Sci, Key Lab Nucl Mat & Safety Assessment, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China 5.Yanshan Univ, Sch Mech Engn, 438 HeBei Rd, Qinhuangdao 066004, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Jian Yang,Sun, Ming Yue,Xu, Bin,et al. Evolution of the interfacial microstructure during the plastic deformation bonding of copper[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2019,746:1-10.
APA	Zhang, Jian Yang.,Sun, Ming Yue.,Xu, Bin.,Hu, Xin.,Liu, Sheng.,...&Li, Dian Zhong.(2019).Evolution of the interfacial microstructure during the plastic deformation bonding of copper.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,746,1-10.
MLA	Zhang, Jian Yang,et al."Evolution of the interfacial microstructure during the plastic deformation bonding of copper".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 746(2019):1-10.