| Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation | |
| Yuan, Jie1,2; Qian, Xitang1,2; Meng, Zhichao1,2; Yang, Bo4; Liu, Zhi-Quan1,2,3 | |
| Corresponding Author | Liu, Zhi-Quan(zqliu@siat.ac.cn) |
| 2019-05-15 | |
| Source Publication | ACS APPLIED MATERIALS & INTERFACES
 |
| ISSN | 1944-8244 |
| Volume | 11Issue:19Pages:17915-17924 |
| Abstract | Here, a facile, low-cost, and high-efficiency method to construct a vertically aligned hexagonal boron nitride nanosheet (hBNN) thermal conduction channel structure is proposed to improve the thermal conductivity. First, exfoliated negatively charged BNNs and positively charged FeCo nanocubes self-assemble to form complex nanomaterials by strong electrostatic interactions. Then, the BNNs can orient with FeCo nanocubes in magnetic field, and the {001} facets of BNNs adsorb on the {100} facets of FeCo nanocubes. The large scale range and high-density FeCo/hBN-aligned structures are observed by scanning electron microscopy, which can act as thermal dissipation channels by conveying more phonons through a preponderant thermally conductive direction. The thermal conductivity of the composite films with 30 wt % FeCo and 50 wt % BN filler is 2.25 W m(-1) K-1, 7 times higher than that of the films only containing 50 wt % randomly distributed hBN filler (0.325 W m(-1) K-1) and 20 times higher than pure polydimethylsiloxane films (0.114 W m(-1) K-1). The thermal management capability of the composite films is evaluated as a thermal conducting substrate of a light-emitting diode chip and the infrared thermal technology. Apart from the surprising thermal conductivity, FeCo-BNNs composite films also exhibit superb flexibility. |
| Keyword | hexagonal boron nitride nanosheets (hBNNs) magnetic FeCo nanocubes electrostatic interactions vertically orientation thermal conductivity |
| Funding Organization | National Key R&D Project from Minister of Science and Technology of China ; National Natural Science Foundation of China ; Shenzhen International Cooperation Project |
| DOI | 10.1021/acsami.9b06062 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Project from Minister of Science and Technology of China[2017YFB0406000] ; National Natural Science Foundation of China[51601033] ; Shenzhen International Cooperation Project[GJHZ20180420180909654] |
| WOS Research Area | Science & Technology - Other Topics ; Materials Science |
| WOS Subject | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary |
| WOS ID | WOS:000468364500087 |
| Publisher | AMER CHEMICAL SOC |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/133378 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Liu, Zhi-Quan |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China 3.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China 4.Northeastern Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Anisotropy & Texture Mat, Shenyang 110819, Liaoning, Peoples R China |
| Recommended Citation GB/T 7714 | Yuan, Jie,Qian, Xitang,Meng, Zhichao,et al. Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation[J]. ACS APPLIED MATERIALS & INTERFACES,2019,11(19):17915-17924. |
| APA | Yuan, Jie,Qian, Xitang,Meng, Zhichao,Yang, Bo,&Liu, Zhi-Quan.(2019).Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation.ACS APPLIED MATERIALS & INTERFACES,11(19),17915-17924. |
| MLA | Yuan, Jie,et al."Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation".ACS APPLIED MATERIALS & INTERFACES 11.19(2019):17915-17924. |
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