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Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition
Li, Sujie1,2; Zhu, Qingsheng1; Zheng, Boda1; Yuan, Jie1; Wang, Xiaojing2
Corresponding AuthorZhu, Qingsheng(qszhu@imr.ac.cn) ; Wang, Xiaojing(wxj@just.edu.cn)
2019-06-05
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
Volume758Pages:1-6
AbstractAn equiaxed grained nanotwinned Cu was firstly prepared by direct current electroplating using composite gelatin and poly-2-sulfur-2-propane sodium sulfonate additive, whose microstructure was similar to that prepared by pulse electroplating. This equiaxed grained nanotwinned Cu exhibited an ultrahigh tensile strength of 764 MPa, about 40% higher than that of columnar grained nanotwinned Cu. It suggested that the ultrahigh strength of Cu can be achieved through a microstructure of fine equiaxed grained nanotwin rather than large columnar grained nanotwin. It was thought that the grain growth along preferred orientation could be prevented through the dynamic competitive adsorption of poly-2-sulfur-2-propane sodium sulfonate and gelatin, which well explained the microstructural modification from columnar grain into equiaxed grain after SPS addition. The preparation of nt-Cu with ultrahigh strength by direct current electroplating has a potential application in production of ultrathin Cu foil used in lithium ion battery.
KeywordElectroplating Cu Gelatin Equiaxed microstructure Twinning
Funding OrganizationNational Natural Science Foundation of China ; Science and Technology Program of Shenyang ; Jiangsu Planning Project of Science and Technology
DOI10.1016/j.msea.2019.04.107
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China[51541104] ; Science and Technology Program of Shenyang[F16-205-1-18] ; Jiangsu Planning Project of Science and Technology[BK20150466]
WOS Research AreaScience & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000471737800001
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:7[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/133870
Collection中国科学院金属研究所
Corresponding AuthorZhu, Qingsheng; Wang, Xiaojing
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China
2.Jiangsu Univ Sci & Technol, Coll Mat Sci & Engn, Zhenjiang 212001, Jiangsu, Peoples R China
Recommended Citation
GB/T 7714
Li, Sujie,Zhu, Qingsheng,Zheng, Boda,et al. Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2019,758:1-6.
APA Li, Sujie,Zhu, Qingsheng,Zheng, Boda,Yuan, Jie,&Wang, Xiaojing.(2019).Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,758,1-6.
MLA Li, Sujie,et al."Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 758(2019):1-6.
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