| Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition | |
| Li, Sujie1,2; Zhu, Qingsheng1; Zheng, Boda1; Yuan, Jie1; Wang, Xiaojing2 | |
| Corresponding Author | Zhu, Qingsheng(qszhu@imr.ac.cn) ; Wang, Xiaojing(wxj@just.edu.cn) |
| 2019-06-05 | |
| Source Publication | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
 |
| ISSN | 0921-5093 |
| Volume | 758Pages:1-6 |
| Abstract | An equiaxed grained nanotwinned Cu was firstly prepared by direct current electroplating using composite gelatin and poly-2-sulfur-2-propane sodium sulfonate additive, whose microstructure was similar to that prepared by pulse electroplating. This equiaxed grained nanotwinned Cu exhibited an ultrahigh tensile strength of 764 MPa, about 40% higher than that of columnar grained nanotwinned Cu. It suggested that the ultrahigh strength of Cu can be achieved through a microstructure of fine equiaxed grained nanotwin rather than large columnar grained nanotwin. It was thought that the grain growth along preferred orientation could be prevented through the dynamic competitive adsorption of poly-2-sulfur-2-propane sodium sulfonate and gelatin, which well explained the microstructural modification from columnar grain into equiaxed grain after SPS addition. The preparation of nt-Cu with ultrahigh strength by direct current electroplating has a potential application in production of ultrathin Cu foil used in lithium ion battery. |
| Keyword | Electroplating Cu Gelatin Equiaxed microstructure Twinning |
| Funding Organization | National Natural Science Foundation of China ; Science and Technology Program of Shenyang ; Jiangsu Planning Project of Science and Technology |
| DOI | 10.1016/j.msea.2019.04.107 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Natural Science Foundation of China[51541104] ; Science and Technology Program of Shenyang[F16-205-1-18] ; Jiangsu Planning Project of Science and Technology[BK20150466] |
| WOS Research Area | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS Subject | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000471737800001 |
| Publisher | ELSEVIER SCIENCE SA |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/133870 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhu, Qingsheng; Wang, Xiaojing |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China 2.Jiangsu Univ Sci & Technol, Coll Mat Sci & Engn, Zhenjiang 212001, Jiangsu, Peoples R China |
| Recommended Citation GB/T 7714 | Li, Sujie,Zhu, Qingsheng,Zheng, Boda,et al. Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2019,758:1-6. |
| APA | Li, Sujie,Zhu, Qingsheng,Zheng, Boda,Yuan, Jie,&Wang, Xiaojing.(2019).Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,758,1-6. |
| MLA | Li, Sujie,et al."Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 758(2019):1-6. |
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