| Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles | |
| Zhao, Meng1; Zhang, Liang1; Liu, Zhi-quan2; Xiong, Ming-yue1; Sun, Lei3; Jiang, Nan1; Xu, Kai-kai1 | |
| Corresponding Author | Zhang, Liang(zhangliang@jsnu.edu.cn) |
| 2019-08-01 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| ISSN | 0957-4522 |
| Volume | 30Issue:16Pages:15054-15063 |
| Abstract | With the purpose of improving the properties of the Sn-3.8Ag-0.7Cu lead-free solder 0.5 wt% micro-CuZnAl particles were added. The experimental results showed that CuZnAl particles had little effect on the melting characteristics of Sn-3.8Ag-0.7Cu alloy. With the addition of CuZnAl particles, the tensile and shear stresses of solder joints were increased by 21% and 19%, respectively, and the microstructure matrix was refined obviously. However, the spreading area of solder was reduced by 7.2% and 3.6% at 230 degrees C and 250 degrees C on Cu substrates, respectively. In addition, the effect of CuZnAl particles on the growth of interfacial IMCs in the structure of Cu/Sn-3.8Ag-0.7Cu/Cu solder joints was studied. The results showed that the addition of 0.5 wt% CuZnAl particles could inhibit the growth of IMCs layer and the formation of voids. |
| Funding Organization | National Key R&D Program of China ; Natural Science Foundation of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Six talent peaks project in Jiangsu Province ; Qing Lan Project ; China Postdoctoral Science Foundation ; International Cooperation Project |
| DOI | 10.1007/s10854-019-01878-w |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Program of China[2017YFB0305700] ; Natural Science Foundation of China[51475220] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Six talent peaks project in Jiangsu Province[XCL-022] ; Qing Lan Project ; China Postdoctoral Science Foundation[2016M591464] ; International Cooperation Project[2015DFA50470] |
| WOS Research Area | Engineering ; Materials Science ; Physics |
| WOS Subject | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| WOS ID | WOS:000480558400025 |
| Publisher | SPRINGER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/134868 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhang, Liang |
| Affiliation | 1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 3.Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing 210016, Jiangsu, Peoples R China |
| Recommended Citation GB/T 7714 | Zhao, Meng,Zhang, Liang,Liu, Zhi-quan,et al. Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(16):15054-15063. |
| APA | Zhao, Meng.,Zhang, Liang.,Liu, Zhi-quan.,Xiong, Ming-yue.,Sun, Lei.,...&Xu, Kai-kai.(2019).Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(16),15054-15063. |
| MLA | Zhao, Meng,et al."Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.16(2019):15054-15063. |
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