| Reliability issues of lead-free solder joints in electronic devices | |
| Jiang, Nan1; Zhang, Liang1,2; Liu, Zhi-Quan3; Sun, Lei4; Long, Wei-Min5; He, Peng2; Xiong, Ming-Yue1; Zhao, Meng1 | |
| Corresponding Author | Zhang, Liang(zhangliang@jsnu.edu.cn) |
| 2019-12-31 | |
| Source Publication | SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
 |
| ISSN | 1468-6996 |
| Volume | 20Issue:1Pages:876-901 |
| Abstract | Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service. |
| Keyword | Lead-free solder reliability IMC crack failure |
| Funding Organization | National Key R&D Program of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Qing Lan Project ; Six talent peaks project in Jiangsu Province ; Natural Science Foundation of China |
| DOI | 10.1080/14686996.2019.1640072 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Program of China[2017YFB0305700] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Qing Lan Project ; Six talent peaks project in Jiangsu Province[XCL-022] ; Natural Science Foundation of China[51475220] ; [2015DFA50470] |
| WOS Research Area | Materials Science |
| WOS Subject | Materials Science, Multidisciplinary |
| WOS ID | WOS:000483617100001 |
| Publisher | TAYLOR & FRANCIS LTD |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/135406 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhang, Liang |
| Affiliation | 1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 2.Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin, Heilongjiang, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China 4.Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing, Jiangsu, Peoples R China 5.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou, Henan, Peoples R China |
| Recommended Citation GB/T 7714 | Jiang, Nan,Zhang, Liang,Liu, Zhi-Quan,et al. Reliability issues of lead-free solder joints in electronic devices[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):876-901. |
| APA | Jiang, Nan.,Zhang, Liang.,Liu, Zhi-Quan.,Sun, Lei.,Long, Wei-Min.,...&Zhao, Meng.(2019).Reliability issues of lead-free solder joints in electronic devices.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),876-901. |
| MLA | Jiang, Nan,et al."Reliability issues of lead-free solder joints in electronic devices".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):876-901. |
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