Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder

doi:10.1007/s10854-019-02107-0

IMR OpenIR

	Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder
	Jiang, Nan 1; Zhang, Liang 1; Liu, Zhi-quan 2; Sun, Lei 3; Xiong, Ming-yue 1; Zhao, Meng 1; Xu, Kai-kai 1
通讯作者	Zhang, Liang(zhangliang@jsnu.edu.cn)
	2019-10-01
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
卷号	30 期号:19 页码:17583-17590
摘要	In this paper, the influences of adding Titanium (Ti) nanoparticles on melting characteristics, wettability, shear properties and the growth of interfacial intermetallic compounds (IMC) of Sn58Bi solder were investigated. The results show that the addition of Ti nanoparticles improved the wettability and shear strength of Sn58Bi solder, and the optimum additive content was 0.1 wt%. The microstructure of the Sn58Bi solder was refined obviously with the addition of Ti nanoparticles. The thickness of interfacial IMC reduced significantly by adding Ti nanoparticles. However, doping Ti nanoparticles had the slight effect on the melting temperature of Sn58Bi solder. Moreover, the thickness of IMC at the Sn58Bi/Cu interface was distinctly larger than that of Sn58Bi-0.1Ti/Cu solder after multiple reflows, which means that the addition of Ti nanoparticles could suppress the growth of IMC at solder/Cu interface during multiple reflows.
资助者	National Key R&D Program of China ; Natural Science Foundation of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Six talent peaks project in Jiangsu Province ; Qing Lan Project, China Postdoctoral Science Foundation ; International Cooperation Project
DOI	10.1007/s10854-019-02107-0
收录类别	SCI
语种	英语
资助项目	National Key R&D Program of China[2017YFB0305700] ; Natural Science Foundation of China[51475220] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Six talent peaks project in Jiangsu Province[XCL-022] ; Qing Lan Project, China Postdoctoral Science Foundation[2016M591464] ; International Cooperation Project[2015DFA50470]
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000490120000006
出版者	SPRINGER
引用统计	被引频次：40[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/135663
专题	中国科学院金属研究所
通讯作者	Zhang, Liang
作者单位	1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 3.Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing 210016, Jiangsu, Peoples R China
推荐引用方式 GB/T 7714	Jiang, Nan,Zhang, Liang,Liu, Zhi-quan,et al. Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(19):17583-17590.
APA	Jiang, Nan.,Zhang, Liang.,Liu, Zhi-quan.,Sun, Lei.,Xiong, Ming-yue.,...&Xu, Kai-kai.(2019).Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(19),17583-17590.
MLA	Jiang, Nan,et al."Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.19(2019):17583-17590.