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The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding
Du, Yahong1,2; Liu, Zhi-Quan1,2; Ji, Hongjun3; Li, Mingyu3; Wen, Ming4
Corresponding AuthorLiu, Zhi-Quan(zqliu@imr.ac.cn) ; Wen, Ming(wen@ipm.com.cn)
2018-08-01
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume29Issue:16Pages:13774-13781
AbstractThe palladium (Pd) distribution over the free air ball (FAB) and its effect on the ball's shear strength were investigated in the Pd-coated copper (Cu) wire bonding process. It was found that for the same FAB/wire diameter ratio of 1.5, the bigger the electrical flame-off (EFO) current was, the larger would be the exposed Cu regions over FAB without Pd distribution. Combining experimental observations, a model of Pd distribution over FAB was first proposed by changing the EFO current and firing time. As the firing time increased, the coated Pd element could be dissolved into the Cu base to form a PdCu alloy at the FAB surface, to protect the bonded ball from corrosion. The Pd-coated Cu wire has higher bonding shear strength than the bare Cu wire. However, the FAB with the largest Pd coverage had the smallest ball shear strength, which revealed that the control of Pd distribution over FAB is very critical for a high-quality bonding interface.
Funding OrganizationNational Key R&D Program of China ; National Natural Science Foundation of China ; State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals
DOI10.1007/s10854-018-9508-z
Indexed BySCI
Language英语
Funding ProjectNational Key R&D Program of China[2017YFB0305700] ; National Natural Science Foundation of China[51564025] ; State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals[SKL-SPM-201803]
WOS Research AreaEngineering ; Materials Science ; Physics
WOS SubjectEngineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS IDWOS:000439338500038
PublisherSPRINGER
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/135909
Collection中国科学院金属研究所
Corresponding AuthorLiu, Zhi-Quan; Wen, Ming
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China
3.Harbin Inst Technol Shenzhen, State Key Lab Adv Welding & Joining, Shenzhen 518055, Peoples R China
4.Kunming Inst Precious Met, Kunming 650106, Yunnan, Peoples R China
Recommended Citation
GB/T 7714
Du, Yahong,Liu, Zhi-Quan,Ji, Hongjun,et al. The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(16):13774-13781.
APA Du, Yahong,Liu, Zhi-Quan,Ji, Hongjun,Li, Mingyu,&Wen, Ming.(2018).The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(16),13774-13781.
MLA Du, Yahong,et al."The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.16(2018):13774-13781.
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