| Highly solderability of FeP film in contact with SnAgCu solder | |
| Zhou, Haifei1; Guo, Jingdong2; Shang, Jianku3; Song, Xiaoning1 | |
| Corresponding Author | Guo, Jingdong(jdguo@imr.ac.cn) ; Shang, Jianku(jkshang@illinois.edu) |
| 2020-03-25 | |
| Source Publication | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| ISSN | 0925-8388 |
| Volume | 818Pages:6 |
| Abstract | New under bump metallization (UBM) is required for future microelectronics to minimize reliability concerns with solder interconnects. In this study, electroless FeP film was prepared as UBM. Solderability of electroless NiP, electrodeposite Fe and electroless FeP films with eutectic SnAgCu solder was investigated by static wetting tests and wetting balance measurements. Results revealed that the solderability of NiP film has almost no change with thermal aged for the film in air atmosphere increasing. The contact angles for FeP and Fe films with SnAgCu solder increased and the maximum wetting force decreased with heating time increasing from 0 h, 48 h, 89 h-160 h at 180 degrees C. But the solderability of FeP film was found to be better than those of NiP and Fe whether the films in base or thermal aged at 180 degrees C for 89 h. Even after thermal aged in air atmosphere at 180 degrees C for 160 h, the FeP also performed the smallest contace angle compared with the NiP and the Fe. Oxide layer on the surface of FeP was much easier to be removed by rosin mildly activated flux during reflow process because loose structure. It was proved to be the key for the highly solderability of electroless FeP. (C) 2019 Elsevier B.V. All rights reserved. |
| Keyword | Solderability Electroless FeP SnAgCu Oxidation |
| Funding Organization | State Grid Scientific and Technological Research Program of China |
| DOI | 10.1016/j.jallcom.2019.152900 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | State Grid Scientific and Technological Research Program of China[5211DS17001X] |
| WOS Research Area | Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS Subject | Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000506166900072 |
| Publisher | ELSEVIER SCIENCE SA |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/136330 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Guo, Jingdong; Shang, Jianku |
| Affiliation | 1.Zhejiang Elect Power Corp Res Inst, Hangzhou 310014, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 3.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA |
| Recommended Citation GB/T 7714 | Zhou, Haifei,Guo, Jingdong,Shang, Jianku,et al. Highly solderability of FeP film in contact with SnAgCu solder[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2020,818:6. |
| APA | Zhou, Haifei,Guo, Jingdong,Shang, Jianku,&Song, Xiaoning.(2020).Highly solderability of FeP film in contact with SnAgCu solder.JOURNAL OF ALLOYS AND COMPOUNDS,818,6. |
| MLA | Zhou, Haifei,et al."Highly solderability of FeP film in contact with SnAgCu solder".JOURNAL OF ALLOYS AND COMPOUNDS 818(2020):6. |
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