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Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process
Hua, Fu-an1; Song, Hong-wu2; Sun, Tao1; Li, Jian-ping1
Corresponding AuthorSong, Hong-wu(hwsong@imr.ac.cn)
2020-03-01
Source PublicationMETALS AND MATERIALS INTERNATIONAL
ISSN1598-9623
Volume26Issue:3Pages:333-345
AbstractA model based on inter-diffusion theory was established to predict growth kinetics of the intermetallic compounds (IMCs) formed in roll bonded Al/Cu sheets during annealing process. The model can give good prediction of both IMC layers growth kinetics and element concentration distribution at the interface of roll bonded Cu/Al sheets with different thickness under different annealing conditions with certain roll reduction range. It is revealed that the calculated results of the proposed model are depended on the inter-diffusion coefficient of each components, which could be related to the interface bonding state, i.e., bonding methods or rolling reductions for roll bonding. And there was big difference in inter-diffusion coefficient of Al and Cu matrix under different bonding state, while the inter-diffusion coefficient of IMCs changed slightly. Graphic
KeywordBimetal Cold roll bonding Intermetallic compound Growth kinetics Inter-diffusion
DOI10.1007/s12540-019-00333-z
Indexed BySCI
Language英语
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000517098900007
PublisherKOREAN INST METALS MATERIALS
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/137365
Collection中国科学院金属研究所
Corresponding AuthorSong, Hong-wu
Affiliation1.Northeastern Univ, State Key Lab Rolling & Automat, Shenyang 110819, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Hua, Fu-an,Song, Hong-wu,Sun, Tao,et al. Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process[J]. METALS AND MATERIALS INTERNATIONAL,2020,26(3):333-345.
APA Hua, Fu-an,Song, Hong-wu,Sun, Tao,&Li, Jian-ping.(2020).Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process.METALS AND MATERIALS INTERNATIONAL,26(3),333-345.
MLA Hua, Fu-an,et al."Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process".METALS AND MATERIALS INTERNATIONAL 26.3(2020):333-345.
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