Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics
Wang, Xin1; Huang, Feirong1; Wang, Dongxing2; Li, Da3; Li, Pu4; Muhammad, Javid1; Dong, Xinglong1; Zhang, Zhidong3
Corresponding AuthorDong, Xinglong(
Source PublicationNANOTECHNOLOGY
AbstractIn this work, Ag-Cu and Ag-Sn nanoparticles (NPs) were synthesized by a physical vapor condensation method, i.e. DC arc-discharge plasma. The as-prepared bimetallic NPs consist of metallic cores of Ag-Cu or Ag-Sn and ultrathin oxide shells of CuO or a hybrid of SnO and SnO2. Ag-Sn NPs exhibit a room-temperature resistivity of 4.24 x 10(-5) omega cm, a little lower than 7.10 x 10(-5) omega cm of Ag-Cu NPs. Both bimetallic NPs demonstrate typical metallic conduction behavior with a positive temperature coefficient of resistance over 25-300 K. Ag-Sn NPs exhibit thermally competitive stability up to 230 degrees C and a lower resistivity of 3.18 x 10(-5) omega cm after sintering at 200 degrees C, giving it potential for application in flexible printed electronics.
KeywordDC arc-discharge method bimetallic nanoparticles printed electronics thermal stability resistivity
Funding OrganizationNational Natural Science Foundation of China
Indexed BySCI
Funding ProjectNational Natural Science Foundation of China[51331006] ; National Natural Science Foundation of China[51271044]
WOS Research AreaScience & Technology - Other Topics ; Materials Science ; Physics
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied
WOS IDWOS:000520169000001
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Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Corresponding AuthorDong, Xinglong
Affiliation1.Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Mat Modificat Laser Ion & Elect Beams, Minist Educ, Dalian 116023, Peoples R China
2.Ningbo Univ Technol, Inst Mat, Ningbo 315016, Peoples R China
3.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Int Ctr Mat Phys, Shenyang 110016, Peoples R China
4.China United Test & Certificat Co LTD, Gen Res Inst Nonferrous Met, Beijing 100088, Peoples R China
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GB/T 7714
Wang, Xin,Huang, Feirong,Wang, Dongxing,et al. Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics[J]. NANOTECHNOLOGY,2020,31(13):9.
APA Wang, Xin.,Huang, Feirong.,Wang, Dongxing.,Li, Da.,Li, Pu.,...&Zhang, Zhidong.(2020).Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics.NANOTECHNOLOGY,31(13),9.
MLA Wang, Xin,et al."Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics".NANOTECHNOLOGY 31.13(2020):9.
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