The damage mechanism of 17vol.%SiCp/Al composite under uniaxial tensile stress | |
Shen, Qiuyan1,2; Yuan, Zhanwei1,2; Liu, Huan1,2; Zhang, Xuemin1; Fu, Qinqin3; Wang, Quanzhao4 | |
Corresponding Author | Yuan, Zhanwei(yuanyekingfly@163.com) ; Wang, Quanzhao(qzhwang@imr.ac.cn) |
2020-04-24 | |
Source Publication | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
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ISSN | 0921-5093 |
Volume | 782Pages:11 |
Abstract | In this paper, the deformation, fracture and damage behavior of SiCp/Al composites are studied by experiments and finite element analysis. The crack cracking process of the material was observed by in-situ tensile test, it was found that the composite first produced microcracks near the particles, and the cracks mainly spread to depth and then to both sides. It is determined by a tensile test that the fracture mechanism of the material is the tearing of the aluminum matrix and the peeling between the particles and the matrix. The tensile damage mechanism of the composite material in three directions (rolling direction, rolling transverse direction and rolling normal direction) and different strains were determined. It is found that in the process of tensile deformation, microcracks are first formed at the defects (voids) and weak interfaces, and many fine cracks converge together to form large cracks leading to the fracture of the material, during which a few particles fall off, but there is no particle fracture. The global and local tensile tests of the composites were simulated by finite element method, the results of the stress-strain state under different strains and the effects of particles on the materials are analyzed in detail, and the validity of the test results is determined. |
Keyword | SiCp/Al composite Damage behavior Fracture mechanism Finite element method Stress-state |
Funding Organization | China Postdoctoral Science Foundation ; National Science and Technology Major Project ; Fundamental Research Funds for the Central Universities, CHD |
DOI | 10.1016/j.msea.2020.139274 |
Indexed By | SCI |
Language | 英语 |
Funding Project | China Postdoctoral Science Foundation[2017M623084] ; National Science and Technology Major Project[2017-VII-0012-0107] ; Fundamental Research Funds for the Central Universities, CHD[310831172001] ; Fundamental Research Funds for the Central Universities, CHD[300102319101] ; Fundamental Research Funds for the Central Universities, CHD[300102310201] |
WOS Research Area | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
WOS Subject | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS ID | WOS:000525797900023 |
Publisher | ELSEVIER SCIENCE SA |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/138235 |
Collection | 中国科学院金属研究所 |
Corresponding Author | Yuan, Zhanwei; Wang, Quanzhao |
Affiliation | 1.Changan Univ, Sch Mat Sci & Engn, Xian 710061, Shaanxi, Peoples R China 2.Changan Univ, Lab Adv Technol & Equipment, Xian 710061, Shaanxi, Peoples R China 3.Xi An Jiao Tong Univ, Ctr Advancing Mat Performance Nanoscale CAMP Nano, HARCC, State Key Lab Mech Behav Mat, Xian 710049, Shaanxi, Peoples R China 4.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China |
Recommended Citation GB/T 7714 | Shen, Qiuyan,Yuan, Zhanwei,Liu, Huan,et al. The damage mechanism of 17vol.%SiCp/Al composite under uniaxial tensile stress[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2020,782:11. |
APA | Shen, Qiuyan,Yuan, Zhanwei,Liu, Huan,Zhang, Xuemin,Fu, Qinqin,&Wang, Quanzhao.(2020).The damage mechanism of 17vol.%SiCp/Al composite under uniaxial tensile stress.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,782,11. |
MLA | Shen, Qiuyan,et al."The damage mechanism of 17vol.%SiCp/Al composite under uniaxial tensile stress".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 782(2020):11. |
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