Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging

doi:10.1007/s40195-020-01059-3

IMR OpenIR

	Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging
	Wang, Changchang 1,2; Chen, Yinbo 1,2; Liu, Zhi-Quan 1,2,3
通讯作者	Liu, Zhi-Quan(zqliu@siat.ac.cn)
	2020-05-15
发表期刊	ACTA METALLURGICA SINICA-ENGLISH LETTERS
ISSN	1006-7191
卷号	33 期号:10 页码:9
摘要	A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu-Sn intermetallic compound (IMC) during thermal aging at 150 degrees C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under compression is faster, while that under tension is slower. Moreover, the interface between IMC and Sn is smoother under compressive stress, and the corresponding IMC grains are smaller and more uniform than that under tensile stress. According to the growth kinetic analysis, the growth of IMC under general, compressive and tensile states is all controlled by the combination of grain boundary diffusion and volume diffusion with a similar growth exponent (n approximate to 0.4). However, external stress can affect the Ostwald ripening process of grain growth, causing a change of grain size and grain boundary density in the IMC layer. As a result, the IMC growth behavior at the interface of the solder joint will be affected by the applied external normal stress.
关键词	Cu-Sn IMC Growth behavior External stress effect Isothermal aging
资助者	National Key R&D Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)
DOI	10.1007/s40195-020-01059-3
收录类别	SCI
语种	英语
资助项目	National Key R&D Program of China[2017YFB0305501] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934]
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000533049300003
出版者	CHINESE ACAD SCIENCES, INST METAL RESEARCH
引用统计	被引频次：7[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/138791
专题	中国科学院金属研究所
通讯作者	Liu, Zhi-Quan
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
推荐引用方式 GB/T 7714	Wang, Changchang,Chen, Yinbo,Liu, Zhi-Quan. Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2020,33(10):9.
APA	Wang, Changchang,Chen, Yinbo,&Liu, Zhi-Quan.(2020).Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging.ACTA METALLURGICA SINICA-ENGLISH LETTERS,33(10),9.
MLA	Wang, Changchang,et al."Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging".ACTA METALLURGICA SINICA-ENGLISH LETTERS 33.10(2020):9.