Rapid heating induced ultrahigh stability of nanograined copper | |
Li, X. Y.; Zhou, X.; Lu, K. | |
通讯作者 | Li, X. Y.(xyli@imr.ac.cn) ; Lu, K.(lu@imr.ac.cn) |
2020-04-01 | |
发表期刊 | SCIENCE ADVANCES
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ISSN | 2375-2548 |
卷号 | 6期号:17页码:6 |
摘要 | Inherent thermal and mechanical instability of nanograined materials bottlenecks their processing and technological applications. In addition to the traditional stabilization strategy, which is based on alloying, grain boundary relaxation was recently found to be effective in stabilizing nanograined pure metals. Grain boundary relaxation can be induced by deforming very fine nanograins below a critical size, typically several tens of nanometers. Here, we found that rapid heating may trigger intensive boundary relaxation of pure Cu nanograins with sizes up to submicrometers, a length scale with notable instability in metals. The rapidly heated Cu nanograins remain stable at temperatures as high as 0.6 T-m (melting point), even higher than the recrystallization temperature of deformed coarse-grained Cu. The thermally induced grain boundary relaxation originating from the generation of high-density nanotwins offers a alternative approach to stabilizing nanostructured materials. |
资助者 | Ministry of Science and Technology of China ; National Science Foundation of China ; Chinese Academy of Sciences |
DOI | 10.1126/sciadv.aaz8003 |
收录类别 | SCI |
语种 | 英语 |
资助项目 | Ministry of Science and Technology of China[2017YFA0204401] ; Ministry of Science and Technology of China[2017YFA0700700] ; National Science Foundation of China[51231006] ; Chinese Academy of Sciences[zdyz201701] |
WOS研究方向 | Science & Technology - Other Topics |
WOS类目 | Multidisciplinary Sciences |
WOS记录号 | WOS:000530628100037 |
出版者 | AMER ASSOC ADVANCEMENT SCIENCE |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/138811 |
专题 | 中国科学院金属研究所 |
通讯作者 | Li, X. Y.; Lu, K. |
作者单位 | Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China |
推荐引用方式 GB/T 7714 | Li, X. Y.,Zhou, X.,Lu, K.. Rapid heating induced ultrahigh stability of nanograined copper[J]. SCIENCE ADVANCES,2020,6(17):6. |
APA | Li, X. Y.,Zhou, X.,&Lu, K..(2020).Rapid heating induced ultrahigh stability of nanograined copper.SCIENCE ADVANCES,6(17),6. |
MLA | Li, X. Y.,et al."Rapid heating induced ultrahigh stability of nanograined copper".SCIENCE ADVANCES 6.17(2020):6. |
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