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Two-stage Hall-Petch relationship in Cu with recrystallized structure
Tian, Y. Z.1; Ren, Y. P.2; Gao, S.3,4; Zheng, R. X.5; Wang, J. H.6; Pan, H. C.1; Zhang, Z. F.7,8; Tsuji, N.3,4; Qin, G. W.2
Corresponding AuthorTian, Y. Z.(tianyanzhong@mail.neu.edu.cn)
2020-07-01
Source PublicationJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
Volume48Pages:31-35
AbstractAlthough Cu was studied extensively, the Hall-Petch relationship was mainly reported in the coarse-grained regime. In this work, fully recrystallized Cu specimens with a wide grain size regime of 0.51-14.93 mu m manifest a two-stage Hall-Petch relationship. There is a critical grain size of 3 mu m that divides stages I and II where the Hall-Petch slope k value are quite different. The stage II is supposed to be validified down to 100 nm at least by comparing with a Cu-Ag alloy. The critical grain size varies in different materials systems, and the underline mechanisms are discussed based on the dislocation glide modes. (C) 2020 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
KeywordCu Yield strength Hall-Petch relationship Ultrafine grain Recrystallization
Funding OrganizationFundamental Research Funds for the Central Universities ; Chinese Academy of Sciences (CAS) ; Japan Society for the Promotion of Science (JSPS) ; Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan, through the Elements Strategy Initiative for Structural Materials (ESISM) ; Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan
DOI10.1016/j.jmst.2019.12.023
Indexed BySCI
Language英语
Funding ProjectFundamental Research Funds for the Central Universities[N180204015] ; Chinese Academy of Sciences (CAS)[GJHZ1774] ; Japan Society for the Promotion of Science (JSPS)[GJHZ1774] ; Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan, through the Elements Strategy Initiative for Structural Materials (ESISM) ; Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan[15H05767]
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000534323200005
PublisherJOURNAL MATER SCI TECHNOL
Citation statistics
Cited Times:12[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/138940
Collection中国科学院金属研究所
Corresponding AuthorTian, Y. Z.
Affiliation1.Northeastern Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Anisotropy & Texture Mat, Shenyang 110819, Peoples R China
2.Northeastern Univ, State Key Lab Rolling & Automat, Shenyang 110819, Peoples R China
3.Kyoto Univ, Dept Mat Sci & Engn, Sakyo Ku, Kyoto 6068501, Japan
4.Kyoto Univ, Elements Strategy Initiat Struct Mat ESISM, Sakyo Ku, Kyoto 6068501, Japan
5.Beihang Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Aerosp Adv Mat & Performance, Beijing 100191, Peoples R China
6.State Grid Urban & Rural Elect Power Design Res B, Beijing 100078, Peoples R China
7.Chinese Acad Sci, Inst Met Res, Lab Fatigue & Fracture Mat, Shenyang 110016, Peoples R China
8.Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Peoples R China
Recommended Citation
GB/T 7714
Tian, Y. Z.,Ren, Y. P.,Gao, S.,et al. Two-stage Hall-Petch relationship in Cu with recrystallized structure[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2020,48:31-35.
APA Tian, Y. Z..,Ren, Y. P..,Gao, S..,Zheng, R. X..,Wang, J. H..,...&Qin, G. W..(2020).Two-stage Hall-Petch relationship in Cu with recrystallized structure.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,48,31-35.
MLA Tian, Y. Z.,et al."Two-stage Hall-Petch relationship in Cu with recrystallized structure".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 48(2020):31-35.
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