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Two-stage Hall-Petch relationship in Cu with recrystallized structure
Tian, Y. Z.1; Ren, Y. P.2; Gao, S.3,4; Zheng, R. X.5; Wang, J. H.6; Pan, H. C.1; Zhang, Z. F.7,8; Tsuji, N.3,4; Qin, G. W.2
通讯作者Tian, Y. Z.(tianyanzhong@mail.neu.edu.cn)
2020-07-01
发表期刊JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
卷号48页码:31-35
摘要Although Cu was studied extensively, the Hall-Petch relationship was mainly reported in the coarse-grained regime. In this work, fully recrystallized Cu specimens with a wide grain size regime of 0.51-14.93 mu m manifest a two-stage Hall-Petch relationship. There is a critical grain size of 3 mu m that divides stages I and II where the Hall-Petch slope k value are quite different. The stage II is supposed to be validified down to 100 nm at least by comparing with a Cu-Ag alloy. The critical grain size varies in different materials systems, and the underline mechanisms are discussed based on the dislocation glide modes. (C) 2020 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
关键词Cu Yield strength Hall-Petch relationship Ultrafine grain Recrystallization
资助者Fundamental Research Funds for the Central Universities ; Chinese Academy of Sciences (CAS) ; Japan Society for the Promotion of Science (JSPS) ; Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan, through the Elements Strategy Initiative for Structural Materials (ESISM) ; Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan
DOI10.1016/j.jmst.2019.12.023
收录类别SCI
语种英语
资助项目Fundamental Research Funds for the Central Universities[N180204015] ; Chinese Academy of Sciences (CAS)[GJHZ1774] ; Japan Society for the Promotion of Science (JSPS)[GJHZ1774] ; Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan, through the Elements Strategy Initiative for Structural Materials (ESISM) ; Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan[15H05767]
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号WOS:000534323200005
出版者JOURNAL MATER SCI TECHNOL
引用统计
被引频次:64[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/138942
专题中国科学院金属研究所
通讯作者Tian, Y. Z.
作者单位1.Northeastern Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Anisotropy & Texture Mat, Shenyang 110819, Peoples R China
2.Northeastern Univ, State Key Lab Rolling & Automat, Shenyang 110819, Peoples R China
3.Kyoto Univ, Dept Mat Sci & Engn, Sakyo Ku, Kyoto 6068501, Japan
4.Kyoto Univ, Elements Strategy Initiat Struct Mat ESISM, Sakyo Ku, Kyoto 6068501, Japan
5.Beihang Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Aerosp Adv Mat & Performance, Beijing 100191, Peoples R China
6.State Grid Urban & Rural Elect Power Design Res B, Beijing 100078, Peoples R China
7.Chinese Acad Sci, Inst Met Res, Lab Fatigue & Fracture Mat, Shenyang 110016, Peoples R China
8.Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Peoples R China
推荐引用方式
GB/T 7714
Tian, Y. Z.,Ren, Y. P.,Gao, S.,et al. Two-stage Hall-Petch relationship in Cu with recrystallized structure[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2020,48:31-35.
APA Tian, Y. Z..,Ren, Y. P..,Gao, S..,Zheng, R. X..,Wang, J. H..,...&Qin, G. W..(2020).Two-stage Hall-Petch relationship in Cu with recrystallized structure.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,48,31-35.
MLA Tian, Y. Z.,et al."Two-stage Hall-Petch relationship in Cu with recrystallized structure".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 48(2020):31-35.
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