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Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics
Yang, Yu-Jia1; Zhang, Bin1; Wan, Hong-Yuan2,3; Zhang, Guang-Ping2
Corresponding AuthorZhang, Bin(zhangb@atm.neu.edu.cn) ; Zhang, Guang-Ping(gpzhang@imr.ac.cn)
2020-08-05
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
Volume792Pages:10
AbstractTo enhance the mechanical reliability without sacrificing the electrical conductivity of the flexible electronics, in this work submicmn-thick Cu/Au/PI (CAP) and graphene/Cu/Au/PI (GCAP) films were fabricated successfully by using a series of assembly methods through introducing a graphene passivation layer onto the polyimide (PI)-supported Cu film surface, and a nanoscale gold (Au) interlayer between the Cu/PI interface. Tensile testing results reveal that the yield strength, the fracture strain and the electrical properties of the GCAP film were improved simultaneously. Furthermore, the GCAP film also exhibited a higher fatigue strength than the CAP film. The basic mechanism is mainly attributed to the effective suppression of the Cu/graphene interface on the fatigue extrusion formation through constraining dislocation motion.
KeywordCu Graphene Interface Fatigue extrusions Voids
Funding OrganizationNational Natural Science Foundation of China (NSFC)
DOI10.1016/j.msea.2020.139786
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China (NSFC)[51671050] ; National Natural Science Foundation of China (NSFC)[51971060]
WOS Research AreaScience & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000553980500026
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/140021
Collection中国科学院金属研究所
Corresponding AuthorZhang, Bin; Zhang, Guang-Ping
Affiliation1.Northeastern Univ, Sch Mat Sci & Engn, Key Lab Anisotropy & Texture Mat, Minist Educ, 3-11 Wenhua Rd, Shenyang 110819, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China
3.Univ Sci & Technol China, Sch Mat Sci & Engn, 72 Wenhua Rd, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Yang, Yu-Jia,Zhang, Bin,Wan, Hong-Yuan,et al. Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2020,792:10.
APA Yang, Yu-Jia,Zhang, Bin,Wan, Hong-Yuan,&Zhang, Guang-Ping.(2020).Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,792,10.
MLA Yang, Yu-Jia,et al."Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 792(2020):10.
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