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Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions
Geng, Peng-Fei1,2; Zhao, Jin-Long2; Xi, Tong2; Yang, Chun-Guang2; Yang, Ke2
Corresponding AuthorYang, Chun-Guang(cgyang@imr.ac.cn)
2020-10-16
Source PublicationRARE METALS
ISSN1001-0521
Pages8
AbstractIn this work, the stability of passive film for long-time immersed Cu-bearing L605 (L605-Cu) alloy in the phosphate buffer solution (PBS) was studied by potentiodynamic polarization and electrochemical impedance spectroscopy. The results showed that the impedance of passive film for L605-Cu alloy experienced an initial increase and subsequent stabilization with the increase in the immersion time. In addition, the plate count method was employed to assess the antibacterial durability of L605-Cu alloy againstEscherichia coliafter long-time immersion. The results indicated that the antibacterial rate of L605-Cu alloy presented a declining tendency with the immersion time prolonging. X-ray photoelectron spectroscopy (XPS) was used to analyze the change of the chemical composition in the passive film on L605-Cu alloy immersed in the PBS for different time. The results showed that Cu content and its compounds in the passive film gradually increased with the immersion time prolonging, hinting declined activity of Cu ions penetrating into the passive film, which resulted in a decrease in the antibacterial performance.
KeywordL605-Cu alloy Passive film Antibacterial rate Implant
Funding OrganizationNational Natural Science Foundation of China ; National Key Research and Development Program
DOI10.1007/s12598-020-01599-8
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China[51771199] ; National Natural Science Foundation of China[51631009] ; National Natural Science Foundation of China[51501188] ; National Key Research and Development Program[2016YFB0300205]
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000577854600001
PublisherNONFERROUS METALS SOC CHINA
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/140933
Collection中国科学院金属研究所
Corresponding AuthorYang, Chun-Guang
Affiliation1.Univ Sci & Technol China, Sch Nano Sci & Technol Inst, Suzhou 215300, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Geng, Peng-Fei,Zhao, Jin-Long,Xi, Tong,et al. Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions[J]. RARE METALS,2020:8.
APA Geng, Peng-Fei,Zhao, Jin-Long,Xi, Tong,Yang, Chun-Guang,&Yang, Ke.(2020).Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions.RARE METALS,8.
MLA Geng, Peng-Fei,et al."Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions".RARE METALS (2020):8.
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