Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions | |
Geng, Peng-Fei1,2; Zhao, Jin-Long2; Xi, Tong2; Yang, Chun-Guang2; Yang, Ke2 | |
Corresponding Author | Yang, Chun-Guang(cgyang@imr.ac.cn) |
2020-10-16 | |
Source Publication | RARE METALS
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ISSN | 1001-0521 |
Pages | 8 |
Abstract | In this work, the stability of passive film for long-time immersed Cu-bearing L605 (L605-Cu) alloy in the phosphate buffer solution (PBS) was studied by potentiodynamic polarization and electrochemical impedance spectroscopy. The results showed that the impedance of passive film for L605-Cu alloy experienced an initial increase and subsequent stabilization with the increase in the immersion time. In addition, the plate count method was employed to assess the antibacterial durability of L605-Cu alloy againstEscherichia coliafter long-time immersion. The results indicated that the antibacterial rate of L605-Cu alloy presented a declining tendency with the immersion time prolonging. X-ray photoelectron spectroscopy (XPS) was used to analyze the change of the chemical composition in the passive film on L605-Cu alloy immersed in the PBS for different time. The results showed that Cu content and its compounds in the passive film gradually increased with the immersion time prolonging, hinting declined activity of Cu ions penetrating into the passive film, which resulted in a decrease in the antibacterial performance. |
Keyword | L605-Cu alloy Passive film Antibacterial rate Implant |
Funding Organization | National Natural Science Foundation of China ; National Key Research and Development Program |
DOI | 10.1007/s12598-020-01599-8 |
Indexed By | SCI |
Language | 英语 |
Funding Project | National Natural Science Foundation of China[51771199] ; National Natural Science Foundation of China[51631009] ; National Natural Science Foundation of China[51501188] ; National Key Research and Development Program[2016YFB0300205] |
WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering |
WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS ID | WOS:000577854600001 |
Publisher | NONFERROUS METALS SOC CHINA |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/140933 |
Collection | 中国科学院金属研究所 |
Corresponding Author | Yang, Chun-Guang |
Affiliation | 1.Univ Sci & Technol China, Sch Nano Sci & Technol Inst, Suzhou 215300, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China |
Recommended Citation GB/T 7714 | Geng, Peng-Fei,Zhao, Jin-Long,Xi, Tong,et al. Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions[J]. RARE METALS,2020:8. |
APA | Geng, Peng-Fei,Zhao, Jin-Long,Xi, Tong,Yang, Chun-Guang,&Yang, Ke.(2020).Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions.RARE METALS,8. |
MLA | Geng, Peng-Fei,et al."Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions".RARE METALS (2020):8. |
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