IMR OpenIR
Dalian
Alternative TitleDalian
Wei WANG; Zhongguang WANG; Aiping XIAN; Jianku SHANG
2007
Source PublicationJournal of Materials Science & Technology
ISSN1005-0302
Volume23Issue:1Pages:85-91
AbstractTwo kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling,cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results.
Other AbstractTwo kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling,cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results.
KeywordCBGA Thermal cycling FEM Assembly Cracking
Indexed ByCSCD
Language英语
CSCD IDCSCD:3192610
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/143228
Collection中国科学院金属研究所
Affiliation中国科学院金属研究所
Recommended Citation
GB/T 7714
Wei WANG,Zhongguang WANG,Aiping XIAN,et al. Dalian[J]. Journal of Materials Science & Technology,2007,23(1):85-91.
APA Wei WANG,Zhongguang WANG,Aiping XIAN,&Jianku SHANG.(2007).Dalian.Journal of Materials Science & Technology,23(1),85-91.
MLA Wei WANG,et al."Dalian".Journal of Materials Science & Technology 23.1(2007):85-91.
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