| Bi-Sn熔体在高熵合金上的润湿行为及界面特征 | |
| Alternative Title | Wetting Behavior and Interfacial Characteristics in the Molten Bi-Sn/High-Entropy Alloy System |
| 马国峰1; 张鸿龄1; 孙俪娜1; 贺春林1; 张波2; 张海峰3 | |
| 2018 | |
| Source Publication | 稀有金属材料与工程
 |
| ISSN | 1002-185X |
| Volume | 47.0Issue:008Pages:2500-2505 |
| Abstract | 采用传统座滴法研究了低熔点合金（Bi-Sn）和高熵合金（AlCoFeNiCr和CuCoFeNiCr）之间的润湿行为及界面特征。借助扫描电子显微镜（SEM）和能谱分析（EDS）分析了Bi-Sn/AlCoFeNiCr和Bi-Sn/CuCoFeNiCr界面微观结构。结果表明：AlCoFeNiCr和CuCoFeNiCr高熵合金都是结构单一的固溶体,但Bi-Sn熔体在CuCoFeNiCr高熵合金基体上的润湿性明显地优于Bi-Sn熔体在AlCoFeNiCr高熵合金基体上的润湿性;Bi-Sn/CuCoFeNiCr界面发生剧烈的化学反应,有大量的界面反应物生成,Bi-Sn熔体中的原子Sn主要是沿着CuCoFeNiCr高熵合金中的富铜相扩散,而Bi-Sn/AlCoFeNiCr界面平直,且随着润湿温度的升高,Bi-Sn熔体中的原子向AlCoFeNiCr高熵合金基体的扩散程度加强并伴随化学反应,出现类似＂皮下潜流＂现象;由于CuCoFeNiCr高熵合金中富铜相的存在,为Bi-Sn在CuCoFeNiCr高熵合金基体上的铺展提供了＂润湿通道＂。 |
| Other Abstract | The wetting behavior and the interracial characteristics of the molten Bi-Sn on the A1CoFeNiCr HEA （high entropy alloy） and the CuCoFeNiCr HEA substrate were investigated by a sessile drop method. Scanning electron microscopy （SEM） and energy dispersive X-ray spectrometry （EDS） were used to analyze the microstructure of the Bi-Sn/AICoFeNiCr HEA and Bi-Sn/CuCoFeNiCr HEA interface. The results show that the A1CoFeNiCr HEA and the CuCoFeNiCr HEA form with a single solid solution structure. However, Bi-Sn molten alloy on CuCoFeNiCr HEA substrate has better wetting characteristics than Bi-Sn molten alloy on A1CoFeNiCr HEA substrate. With increasing wetting temperature, a number of intermetallic compounds are generated at the interface between the molten Bi-Sn and the CuCoFeNiCr HEA substrate, and the diffusion of Sn atom along the Cu-rich solid-solution phase in CuCoFeNiCr HEA is much more intense. On the contrary, the interface of the Bi-Sn/AICoFeNiCr HEA system is still the straight interface, and there are new intermetallic compounds on the Bi-Sn/A1CoFeNiCr HEA interface with increasing wetting temperature. It is found that the Cu-rieh phase in CuCoFeNiCr HEA provides a ＂wetting channel＂ for the wetting process between the molten Bi-Sn and CuCoFeNiCr HEA substrate, which result in the two wetting systems with different wetting mechanisms. |
| Keyword | 高熵合金 Bi-Sn熔体 润湿 界面特征 润湿机制 |
| Indexed By | CSCD |
| Language | 中文 |
| CSCD ID | CSCD:6316241 |
| Citation statistics |
Cited Times:1[CSCD]
[CSCD Record]
|
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/143385 |
| Collection | 中国科学院金属研究所 |
| Affiliation | 1.沈阳大学 2.沈阳航空航天大学 3.中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | 马国峰,张鸿龄,孙俪娜,等. Bi-Sn熔体在高熵合金上的润湿行为及界面特征[J]. 稀有金属材料与工程,2018,47.0(008):2500-2505. |
| APA | 马国峰,张鸿龄,孙俪娜,贺春林,张波,&张海峰.(2018).Bi-Sn熔体在高熵合金上的润湿行为及界面特征.稀有金属材料与工程,47.0(008),2500-2505. |
| MLA | 马国峰,et al."Bi-Sn熔体在高熵合金上的润湿行为及界面特征".稀有金属材料与工程 47.0.008(2018):2500-2505. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment