| INVESTIGATIONS ON THERMAL STABILITY OF FATIGUE DISLOCATION STRUCTURES IN CONJUGATE AND CRITICAL DOUBLE-SLIP-ORIENTED Cu SINGLE CRYSTALS | |
| Alternative Title | INVESTIGATIONS ON THERMAL STABILITY OF FATIGUE DISLOCATION STRUCTURES IN CONJUGATE AND CRITICAL DOUBLE-SLIP- ORIENTED Cu SINGLE CRYSTALS |
| Guo Weiwei1; Qi Chengjun1; Li Xiaowu1 | |
| 2016 | |
| Source Publication | ACTA METALLURGICA SINICA
 |
| ISSN | 0412-1961 |
| Volume | 52Issue:6Pages:761-768 |
| Abstract | It is well known that the cyclic deformation behavior and dislocation structures of Cu single crystals with different orientations have been systematically investigated and understood. However, there is as yet no general and unequivocal knowledge of the thermal stability of fatigue-induced dislocation structures in Cu single crystals, which is particularly significant for the further improvement of low energy dislocation structure (LEDS) theory. In previous work, the thermal stability of fatigue dislocation structures in (4) over bar 18 41 single-slip and (2) over bar 33 coplanar double-slip Cu single crystals have been reported. For deeply understanding the orientation-dependent thermal stability of fatigue dislocation structures, in the present work, (2) over bar 23 conjugate and 017 critical double-slip-oriented Cu single crystals were cyclically deformed at different plastic strain amplitudes gamma(pl) up to saturation, and then annealed at different temperatures (300, 500 and 800 degrees C) for 30 min, to examine the thermal stability of various fatigue-induced dislocation structures. It was found that an obvious recovery has occurred in various dislocation structures at 300 degrees C. At the higher temperatures, e.g., 500 and 800 degrees C, a remarkable recrystallization phenomenon takes place together with the formation of many annealing twins. The thermal stability of various dislocation structures produced in fatigued Cu single crystals with different orientations from high to low are on the order of vein structure, persistent slip band (PSB) structure, labyrinth structure and dislocation cells. The annealing twins formed in Cu single crystals with different orientations all develop strictly along the dislocation slip planes, which have been operated under fatigue deformation. The more serious the fatigue-induced slip deformation, the greater the amount of annealing twins would be. Furthermore, an over high annealing temperature, e.g. 800 degrees C, would greatly speed up the migration of boundaries of recrystallized grains to restrain the formation of annealing twins, leading to, more or less, the decrease in the amount of twins. |
| Keyword | CYCLIC DEFORMATION ANNEALING TWINS BEHAVIOR AMPLITUDE Cu single crystal fatigue dislocation structure thermal stability crystallographic orientation recrystallization annealing twin |
| Indexed By | CSCD |
| Language | 英语 |
| Funding Project | [National Natural Science Foundation of China] ; [Specialized Research Fund for the Doctoral Program of Higher Education of China] |
| CSCD ID | CSCD:5720186 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/145769 |
| Collection | 中国科学院金属研究所 |
| Affiliation | 1.中国科学院金属研究所 2.上海市地震局 |
| Recommended Citation GB/T 7714 | Guo Weiwei,Qi Chengjun,Li Xiaowu. INVESTIGATIONS ON THERMAL STABILITY OF FATIGUE DISLOCATION STRUCTURES IN CONJUGATE AND CRITICAL DOUBLE-SLIP-ORIENTED Cu SINGLE CRYSTALS[J]. ACTA METALLURGICA SINICA,2016,52(6):761-768. |
| APA | Guo Weiwei,Qi Chengjun,&Li Xiaowu.(2016).INVESTIGATIONS ON THERMAL STABILITY OF FATIGUE DISLOCATION STRUCTURES IN CONJUGATE AND CRITICAL DOUBLE-SLIP-ORIENTED Cu SINGLE CRYSTALS.ACTA METALLURGICA SINICA,52(6),761-768. |
| MLA | Guo Weiwei,et al."INVESTIGATIONS ON THERMAL STABILITY OF FATIGUE DISLOCATION STRUCTURES IN CONJUGATE AND CRITICAL DOUBLE-SLIP-ORIENTED Cu SINGLE CRYSTALS".ACTA METALLURGICA SINICA 52.6(2016):761-768. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment