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碳化硅颗粒增强铝基复合材料(SiCp/2024Al)的扩散焊研究
赵明久; 吕毓雄; 陈礼清; 毕敬
2000
Source Publication材料研究学报
ISSN1005-3093
Volume14.0Issue:002Pages:136-140
Abstract采用加纯铝箔中间层的方法,研究了15%SiCp/2024Al复合材料的固态扩散焊。结果表明:在温度为570℃、压力为16MPa、焊接时间为60min的条件下,获得了较高质量的复合材料扩散焊接头。对接头进行的剪切强度试验和金相分析发现,焊接界面平行性特征不明显,中国间明显变薄的接头具有较高的剪切强度,扫描电镜观察分析显示,接头断口呈现明显的韧性断裂特征.
Keyword铝基复合材料 碳化硅颗粒 扩散焊接
Indexed ByCSCD
Language中文
CSCD IDCSCD:550849
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/146492
Collection中国科学院金属研究所
Affiliation中国科学院金属研究所
Recommended Citation
GB/T 7714
赵明久,吕毓雄,陈礼清,等. 碳化硅颗粒增强铝基复合材料(SiCp/2024Al)的扩散焊研究[J]. 材料研究学报,2000,14.0(002):136-140.
APA 赵明久,吕毓雄,陈礼清,&毕敬.(2000).碳化硅颗粒增强铝基复合材料(SiCp/2024Al)的扩散焊研究.材料研究学报,14.0(002),136-140.
MLA 赵明久,et al."碳化硅颗粒增强铝基复合材料(SiCp/2024Al)的扩散焊研究".材料研究学报 14.0.002(2000):136-140.
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