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Ti3SiC2弥散强化Cu:一种新的弥散强化铜合金
张毅; 周延春
2000
Source Publication金属学报
ISSN0412-1961
Volume36.0Issue:006Pages:662-666
Abstract选用具有高导电,高导热性能的新型陶瓷Ti3SiC2做为弥散强化相,通过与Cu粉档高能球磨混合后,热压成一种新型弥散强化Cu材料,机械性能测试表明,随着Ti3SiC2体积分数的提高,弥散强化Cu掘 服强度和维氏硬度线性上升,分析表明Ti3SiC2相的晶粒细化和位错塞积是主要强化机制,当颗粒粗化和团聚后Ti3SiC2的强化效果将明显减弱。
Keyword弥散强化 机械性能 Ti3SiC2 铜合金
Indexed ByCSCD
Language中文
CSCD IDCSCD:675609
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/147316
Collection中国科学院金属研究所
Affiliation中国科学院金属研究所
Recommended Citation
GB/T 7714
张毅,周延春. Ti3SiC2弥散强化Cu:一种新的弥散强化铜合金[J]. 金属学报,2000,36.0(006):662-666.
APA 张毅,&周延春.(2000).Ti3SiC2弥散强化Cu:一种新的弥散强化铜合金.金属学报,36.0(006),662-666.
MLA 张毅,et al."Ti3SiC2弥散强化Cu:一种新的弥散强化铜合金".金属学报 36.0.006(2000):662-666.
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