| 温度、pH和Cl^-浓度对NiTi形状记忆合金电化学行为的影响 | |
| Alternative Title | EFFECTS OF TEMPERATURE, Cl^- CONCENTRATION AND pH ON ELECTROCHEMICAL BEHAVIOR OF NiTi SHAPE MEMORY ALLOY |
| 李年杏; 王俭秋; 韩恩厚; 柯伟 | |
| 2006 | |
| Source Publication | 中国腐蚀与防护学报
 |
| ISSN | 1005-4537 |
| Volume | 26.0Issue:004Pages:202-206 |
| Abstract | 通过正交试验法，采用动电位扫描技术研究了温度、pH和Cl^-浓度对NiTi形状记忆合金在模拟口腔溶液中电化学行为的影响．结果表明温度、pH和Cl^-浓度对NiTi的点蚀行为都有较大影响．溶液温度为25℃时点蚀电位最负。随着温度的升高，点蚀电位逐渐升高．溶液中的Cl^-浓度很低时（不超过0．1mol／L）点蚀电位较高，随着CL^-1浓度的增加，点蚀电位急剧下降．当溶液的pH为6．0时，点蚀电位最高． |
| Other Abstract | Potentiodynamic polarization measurement was used to study effects of temperature, Cl^- concentration and pH on the electrochemical behavior of NiTi shape memory alloy （SMA）in the synthetic saliva according to the orthogonal testing method. The results showed that temperature, Cl^- concentration and pH had great influence on the pitting behavior of NiTi. The breakdown potential was most negative at 25℃, and it increased with the increase of temperature. The breakdown potential kept in high level when the Cl^- concentration was not more than 0.1 tool/L, while it dropped sharply with the continuous increase of Cl^- concentration. The breakdown potential was highest at the solution of pH 6.0. |
| Keyword | NiTi形状记忆合金 动电位扫描 正交试验法 生物相容性 |
| Indexed By | CSCD |
| Language | 中文 |
| CSCD ID | CSCD:2416246 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/149606 |
| Collection | 中国科学院金属研究所 |
| Affiliation | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | 李年杏,王俭秋,韩恩厚,等. 温度、pH和Cl^-浓度对NiTi形状记忆合金电化学行为的影响[J]. 中国腐蚀与防护学报,2006,26.0(004):202-206. |
| APA | 李年杏,王俭秋,韩恩厚,&柯伟.(2006).温度、pH和Cl^-浓度对NiTi形状记忆合金电化学行为的影响.中国腐蚀与防护学报,26.0(004),202-206. |
| MLA | 李年杏,et al."温度、pH和Cl^-浓度对NiTi形状记忆合金电化学行为的影响".中国腐蚀与防护学报 26.0.004(2006):202-206. |
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