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TC4-DT电子束焊接头显微组织及疲劳裂纹扩展行为
唐振云; 马英杰; 毛智勇; 雷家峰; 刘羽寅; 李晋炜
2012
Source Publication焊接学报
ISSN0253-360X
Volume33.0Issue:009Pages:109-112
Abstract在光学显微镜下对TC4-DT钛合金电子束焊接头显微组织进行了分析,讨论了接头不同位置显微组织特征.比较了疲劳裂纹始于焊接接头不同位置时的宏观裂纹扩展路径及裂纹扩展速率,依据焊接接头显微组织特点讨论了显微组织对疲劳裂纹扩展行为的影响.结果表明,电子束焊接头沿熔深方向显微组织存在一定的差异;文中条件下,与母材区相比焊缝熔合区及热影响区具有较高的疲劳裂纹扩展抗力,导致裂纹扩展路径逐步偏向母材区,最后讨论了裂纹扩展路径的偏折对裂纹扩展速率的影响.
KeywordTC4-DT 电子束焊 接头显微组织 疲劳裂纹扩展
Indexed ByCSCD
Language中文
CSCD IDCSCD:4650238
Citation statistics
Cited Times:2[CSCD]   [CSCD Record]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/154815
Collection中国科学院金属研究所
Affiliation中国科学院金属研究所
Recommended Citation
GB/T 7714
唐振云,马英杰,毛智勇,等. TC4-DT电子束焊接头显微组织及疲劳裂纹扩展行为[J]. 焊接学报,2012,33.0(009):109-112.
APA 唐振云,马英杰,毛智勇,雷家峰,刘羽寅,&李晋炜.(2012).TC4-DT电子束焊接头显微组织及疲劳裂纹扩展行为.焊接学报,33.0(009),109-112.
MLA 唐振云,et al."TC4-DT电子束焊接头显微组织及疲劳裂纹扩展行为".焊接学报 33.0.009(2012):109-112.
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