Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride-Urea Deep Eutectic Solvents

doi:10.3390/coatings10121154

IMR OpenIR

	Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride-Urea Deep Eutectic Solvents
	Cao, Xiaozhou; Xu, Lulu; Wang, Chao; Li, Siyi; Wu, Dong; Shi, Yuanyuan; Liu, Fengguo; Xue, Xiangxin
	2020-12-01
发表期刊	COATINGS
卷号	10 期号:12
摘要	The electrochemical behavior and electrodeposition of Sn were investigated in choline chloride (ChCl)-urea deep eutectic solvents (DESs) containing SnCl2 by cyclic voltammetry (CV) and chronoamperometry techniques. The electrodeposition of Sn(II) was a quasi-reversible, single-step two-electron-transfer process. The average transfer coefficient and diffusion coefficient of 0.2 M Sn(II) in ChCl-urea at 323 K were 0.29 and 1.35 x 10(-9) cm(2)center dot s(-1). The nucleation overpotential decreased with the increase in temperature and SnCl2 concentration. The results of the chronoamperometry indicated that the Sn deposition on tungsten electrode occurred by three-dimensional instantaneous nucleation and diffusion controlled growth using the Scharifker-Hills model. Scanning electron microscopy (SEM) showed that the morphology of the deposits is uniform, as a dense and compact film prepared by potentiostatic electrolysis on Cu substrate. X-ray diffraction (XRD) analysis revealed that the deposits were pure metallic Sn.
DOI	10.3390/coatings10121154
WOS记录号	WOS:000601947900001
引用统计	被引频次：20[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/155650
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Cao, Xiaozhou,Xu, Lulu,Wang, Chao,et al. Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride-Urea Deep Eutectic Solvents[J]. COATINGS,2020,10(12).
APA	Cao, Xiaozhou.,Xu, Lulu.,Wang, Chao.,Li, Siyi.,Wu, Dong.,...&Xue, Xiangxin.(2020).Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride-Urea Deep Eutectic Solvents.COATINGS,10(12).
MLA	Cao, Xiaozhou,et al."Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride-Urea Deep Eutectic Solvents".COATINGS 10.12(2020).