Ti65合金的初级蠕变和稳态蠕变 | |
Alternative Title | Primary Creep and Steady-State Creep of Ti65 Alloy |
岳颗1; 刘建荣1; 杨锐1; 王清江1 | |
2020 | |
Source Publication | 材料研究学报
![]() |
ISSN | 1005-3093 |
Volume | 000Issue:002Pages:151-160 |
Abstract | 使用透射电镜(TEM)研究了Ti65合金在600~650℃、120~160 MPa条件下的蠕变变形行为及其微观变形机制。结果表明:初级蠕变变形机制主要由受攀移控制的位错越过α2相的过程主导;稳态蠕变阶段蠕变机制主要由受界面处扩散控制的位错攀移的过程主导,且应力指数为5~7。在初级蠕变阶段α2相与位错的相互作用是α2相对合金高温强化的主要方式,在稳态蠕变阶段沿α/β相界分布的硅化物阻碍位错运动与限制晶界滑移是硅化物对合金强化的主要方式。 |
Other Abstract | The creep deformation behavior and relevant microscopic deformation mechanisms of Ti65 alloy were investigated via tensile creep test by stresses in the range of 120~160 MPa at 600~650℃and TEM observation.The results show that the primary creep deformation mechanism is dominated by the process of climbing-controlled dislocations crossing theα2 phases and the creep mechanism in the steady-state creep stage is dominated by the process of diffusion-controlled dislocation climbing at theα/βinterfaces,and the stress index of steady-state creep stage varies from 5 to 7.The hindering of dislocation motions byα2 phases is the dominating process to strengthen the high-temperature creep resistance of Ti65 alloy during the primary creep stage.The silicide precipitates distributed alongα/βphase boundaries,impede the dislocation motions and restrict the grain boundary slip(GBS),which is the dominating strengthening mechanism during the steady-state creep stage. |
Keyword | 材料科学基础学科 蠕变机制 蠕变试验 Ti65合金 |
Indexed By | CSCD |
Language | 中文 |
CSCD ID | CSCD:6661977 |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/157735 |
Collection | 中国科学院金属研究所 |
Affiliation | 1.中国科学院金属研究所 2.中国科学技术大学 |
Recommended Citation GB/T 7714 | 岳颗,刘建荣,杨锐,等. Ti65合金的初级蠕变和稳态蠕变[J]. 材料研究学报,2020,000(002):151-160. |
APA | 岳颗,刘建荣,杨锐,&王清江.(2020).Ti65合金的初级蠕变和稳态蠕变.材料研究学报,000(002),151-160. |
MLA | 岳颗,et al."Ti65合金的初级蠕变和稳态蠕变".材料研究学报 000.002(2020):151-160. |
Files in This Item: | There are no files associated with this item. |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment