| Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect | |
| Alternative Title | Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect |
| Kang T Y1; Xiu Y Y2; Hui L2; Wang J J2; Tong W P1; Liu C Z2 | |
| 2011 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
 |
| ISSN | 1005-0302 |
| Volume | 27Issue:8Pages:741-745 |
| Abstract | The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210 degrees C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Q(a) for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service. |
| Other Abstract | The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service. |
| Keyword | SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics |
| Indexed By | CSCD |
| Language | 英语 |
| Funding Project | [National Natural Science Foundation of China] ; [111 Project] ; [Foundation of National Excellent Doctoral Dissertation of China] ; [Program for New Century Excellent Talents in University] ; [Fundamental Research Funds for the Central Universities] |
| CSCD ID | CSCD:4410852 |
| Citation statistics |
Cited Times:1[CSCD]
[CSCD Record]
|
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/157757 |
| Collection | 中国科学院金属研究所 |
| Affiliation | 1.上海市地震局 2.中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | Kang T Y,Xiu Y Y,Hui L,et al. Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2011,27(8):741-745. |
| APA | Kang T Y,Xiu Y Y,Hui L,Wang J J,Tong W P,&Liu C Z.(2011).Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,27(8),741-745. |
| MLA | Kang T Y,et al."Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 27.8(2011):741-745. |
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