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Boundary layer distributions and cooling rate of cooling sloping plate process
Alternative TitleBoundary Layer Distributions and Cooling Rate of Cooling Sloping Plate Process
Zhao Zhanyong; Guan Renguo; Wang Xiang; Huang Hongqian; Chao Runze; Dong Lei; Liu Chunming
2013
Source PublicationJOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION
ISSN1000-2413
Volume28Issue:4Pages:701-705
AbstractAccording to the principle of grain refining and slurry preparation by cooling sloping plate process, the distributions of boundary layers during melt treatment by cooling sloping plate were studied, and mathematic model of cooling rate was established. The calculation value approximately agrees with the experimental result. Laminar flow and turbulent flow exist on sloping plate surface commonly. The thickness of velocity boundary layer and the critical transfer distance from laminar flow to turbulent flow increase with the decrease of initial flow velocity. The thickness of temperature boundary layer increases with the increment of flow distance and the decrease of initial flow velocity. The melt cooling rate and melt thickness have an inverse proportion relationship. The melt cooling rate increases along the plate direction gradually when the initial flow velocity is lower than 1 m/s, the melt cooling rate keeps nearly a constant when the initial flow velocity is 1 m/s, when the initial flow velocity is higher than 1 m/s, the melt cooling rate decreases gradually. The melt cooling rate of cooling sloping plate process can reach 10(2)-10(3) K/s and belongs to meta-rapid solidification scope.
Other AbstractAccording to the principle of grain refi ning and slurry preparation by cooling sloping plate process, the distributions of boundary layers during melt treatment by cooling sloping plate were studied, and mathematic model of cooling rate was established. The calculation value approximately agrees with the experimental result. Laminar fl ow and turbulent fl ow exist on sloping plate surface commonly. The thickness of velocity boundary layer and the critical transfer distance from laminar fl ow to turbulent fl ow increase with the decrease of initial fl ow velocity. The thickness of temperature boundary layer increases with the increment of fl ow distance and the decrease of initial fl ow velocity. The melt cooling rate and melt thickness have an inverse proportion relationship. The melt cooling rate increases along the plate direction gradually when the initial fl ow velocity is lower than 1 m/s, the melt cooling rate keeps nearly a constant when the initial fl ow velocity is 1 m/ s, when the initial fl ow velocity is higher than 1 m/s, the melt cooling rate decreases gradually. The melt cooling rate of cooling sloping plate process can reach 10~2-10~3 K/s and belongs to meta-rapid solidifi cation scope.
KeywordSEMISOLID ALUMINUM-ALLOY CASTING PROCESS semisolid grain refining sloping plate temperature boundary layer cooling rate
Indexed ByCSCD
Language英语
Funding Project[National Natural Science Foundation for Outstanding Young Scholars of China] ; [National Natural Science Foundation of China] ; [Fok Ying Tong Education Foundation] ; [Basic Scientific Research Operation of Center University] ; [Chinese National Program for Fundamental Research and Development]
CSCD IDCSCD:5077984
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/157980
Collection中国科学院金属研究所
Affiliation中国科学院金属研究所
Recommended Citation
GB/T 7714
Zhao Zhanyong,Guan Renguo,Wang Xiang,et al. Boundary layer distributions and cooling rate of cooling sloping plate process[J]. JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION,2013,28(4):701-705.
APA Zhao Zhanyong.,Guan Renguo.,Wang Xiang.,Huang Hongqian.,Chao Runze.,...&Liu Chunming.(2013).Boundary layer distributions and cooling rate of cooling sloping plate process.JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION,28(4),701-705.
MLA Zhao Zhanyong,et al."Boundary layer distributions and cooling rate of cooling sloping plate process".JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION 28.4(2013):701-705.
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