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一种高密度电路板中微细盲孔的铜电镀填充方法
祝清省、祝汉品、崔学顺、张贤
2019-10-22
Rights Holder祝清省、祝汉品、崔学顺、张贤
Country中国
Subtype发明专利
Patent Number201610265605.2
Document Type专利
Identifierhttp://ir.imr.ac.cn/handle/321006/158451
Collection中国科学院金属研究所
Affiliation中国科学院金属研究所
Recommended Citation
GB/T 7714
祝清省、祝汉品、崔学顺、张贤. 一种高密度电路板中微细盲孔的铜电镀填充方法. 201610265605.2[P]. 2019-10-22.
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