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Ultrasensitive Strain Sensors Based on Cu-Al Alloy Films with Voided Cluster Boundaries
Wu, Xuping1,2; Chen, Honglei1,2; Luo, Xuemei1; Wang, Dong3,4; Schaaf, Peter3,4; Zhang, Guangping1
Corresponding AuthorLuo, Xuemei(xmluo@imr.ac.cn) ; Zhang, Guangping(gpzhang@imr.ac.cn)
2021-08-10
Source PublicationADVANCED MATERIALS TECHNOLOGIES
ISSN2365-709X
Pages12
AbstractStimulated by the requirement for wearable electronics, crack-based strain sensors made from polymer-supported metal films have been reported as a prospective structure for detecting subtle deformation with ultrahigh sensitivity and excellent flexibility. However, the regulation of crack preparation remains a challenge and the use of noble metals retards the large-scale promotion toward practical application. Here, a cost-effective strain sensor with ultrahigh strain sensitivity under small strains (epsilon) is designed based on the submicron to nanoscale voided clusters in Cu-Al alloy films. The formation of channel cracks in the film is manipulated by regulating the intrinsic microstructure of the film, and the corresponding mechanism is discussed in detail. The strain sensor developed from the cracked Cu-Al film exhibits ultrahigh gauge factors as high as 584 (0% epsilon < 0.5%), 10219 (0.5% epsilon < 0.9%), 43152 (0.9% epsilon < 1.75%) which is among the highest in reported values. Furthermore, the practical application of the developed sensor in wearable electronics and detection of small deformation is demonstrated. This work provides a novel approach to optimize the sensing performance of flexible strain sensors.
Keywordchannel cracks microstructure strain sensors ultrasensitive wearable electronics
Funding OrganizationNational Natural Science Foundation of China (NSFC) ; Foundation for Outstanding Young Scholar - Institute of Metal Research (IMR) ; Foundation for Outstanding Young Scholar - Shenyang National Laboratory for Materials Science ; Fundamental Research Project of Shenyang National Laboratory for Materials Science
DOI10.1002/admt.202100524
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China (NSFC)[52071319] ; Foundation for Outstanding Young Scholar - Institute of Metal Research (IMR) ; Foundation for Outstanding Young Scholar - Shenyang National Laboratory for Materials Science[L2019F23] ; Fundamental Research Project of Shenyang National Laboratory for Materials Science[L2019R18]
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000683599500001
PublisherWILEY
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/159325
Collection中国科学院金属研究所
Corresponding AuthorLuo, Xuemei; Zhang, Guangping
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, 72 Wenhua Rd, Shenyang 110016, Peoples R China
3.TU Ilmenau, Inst Mat Sci & Engn, Gustav Kirchhoff Str 5, D-98693 Ilmenau, Germany
4.TU Ilmenau, Inst Micro & Nanotechnol MacroNano, Chair Mat Elect Engn & Elect, Gustav Kirchhoff Str 5, D-98693 Ilmenau, Germany
Recommended Citation
GB/T 7714
Wu, Xuping,Chen, Honglei,Luo, Xuemei,et al. Ultrasensitive Strain Sensors Based on Cu-Al Alloy Films with Voided Cluster Boundaries[J]. ADVANCED MATERIALS TECHNOLOGIES,2021:12.
APA Wu, Xuping,Chen, Honglei,Luo, Xuemei,Wang, Dong,Schaaf, Peter,&Zhang, Guangping.(2021).Ultrasensitive Strain Sensors Based on Cu-Al Alloy Films with Voided Cluster Boundaries.ADVANCED MATERIALS TECHNOLOGIES,12.
MLA Wu, Xuping,et al."Ultrasensitive Strain Sensors Based on Cu-Al Alloy Films with Voided Cluster Boundaries".ADVANCED MATERIALS TECHNOLOGIES (2021):12.
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