| Effect of Nanoscale Cu-Riched Clusters on Strength and Impact Toughness in a Tempered Cu-Bearing HSLA Steel | |
| Du, Yubin1,2; Hu, Xiaofeng1; Song, Yuanyuan1; Zhang, Yangpeng1; Rong, Lijian1 | |
| Corresponding Author | Hu, Xiaofeng(xfhu@imr.ac.cn) ; Rong, Lijian(ljrong@imr.ac.cn) |
| 2021-07-10 | |
| Source Publication | ACTA METALLURGICA SINICA-ENGLISH LETTERS
 |
| ISSN | 1006-7191 |
| Pages | 14 |
| Abstract | The effect of Cu-riched clusters on strength and impact toughness in a tempered Cu-bearing high-strength low-alloy (HSLA) steel is investigated. With increasing the tempering temperature, it is found that the yield strength increases firstly, achieving the maximum value (similar to 1053 MPa) at the tempering temperature of 450 degrees C, and then decreases significantly with the rise of tempering temperature. The tempering temperature-dependent yield strength is closely related to the precipitation of Cu-riched clusters. When tempering at 450 degrees C, the peak strength will be reached as the nanoscale Cu-riched clusters with small size and high number density will cause a strong precipitation strengthening (similar to 492 MPa) due to the dislocation shearing mechanism. However, the Cu-riched clusters will coarsen with further increasing tempering temperature, resulting in obvious decrement of yield strength owing to the dislocation bypassing mechanism. Compared with the yield strength, the variation in impact energy displays an inverse tendency and the impact energy is only 7 J for the sample tempered at 450 degrees C. The fracture mode can be well explained by the competition between the cleavage fracture strength (sigma(F)) and "yield strength" (sigma(Y)). Although transgranular cleavage fracture can be found in samples tempered at 450 and 550 degrees C, the crack propagation along the lath boundaries is prevented in the sample tempered at 550 degrees C. The reason is that the number density of Cu-riched clusters at lath boundaries decreases and the segregation of Mo element at the lath boundaries is induced, which will increase the bonding energy. |
| Keyword | High-strength low-alloy (HSLA) steel Cu-riched cluster Strengthening mechanism Lath boundary Impact energy |
| Funding Organization | National Key Research and Development Program of China ; Liaoning Revitalization Talents Program ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Liaoning Natural Science Foundation |
| DOI | 10.1007/s40195-021-01277-3 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key Research and Development Program of China[2016YFB0300601] ; Liaoning Revitalization Talents Program[XLYC1907143] ; Strategic Priority Research Program of the Chinese Academy of Sciences[XDC04000000] ; Liaoning Natural Science Foundation[2020-MS-008] |
| WOS Research Area | Metallurgy & Metallurgical Engineering |
| WOS Subject | Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000672443800001 |
| Publisher | CHINESE ACAD SCIENCES, INST METAL RESEARCH |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/159979 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Hu, Xiaofeng; Rong, Lijian |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, CAS Key Lab Nucl Mat & Safety Assessment, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China |
| Recommended Citation GB/T 7714 | Du, Yubin,Hu, Xiaofeng,Song, Yuanyuan,et al. Effect of Nanoscale Cu-Riched Clusters on Strength and Impact Toughness in a Tempered Cu-Bearing HSLA Steel[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2021:14. |
| APA | Du, Yubin,Hu, Xiaofeng,Song, Yuanyuan,Zhang, Yangpeng,&Rong, Lijian.(2021).Effect of Nanoscale Cu-Riched Clusters on Strength and Impact Toughness in a Tempered Cu-Bearing HSLA Steel.ACTA METALLURGICA SINICA-ENGLISH LETTERS,14. |
| MLA | Du, Yubin,et al."Effect of Nanoscale Cu-Riched Clusters on Strength and Impact Toughness in a Tempered Cu-Bearing HSLA Steel".ACTA METALLURGICA SINICA-ENGLISH LETTERS (2021):14. |
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