Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu-metalized AlN substrate

doi:10.1111/jace.18092

IMR OpenIR

	Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu-metalized AlN substrate
	Zhang, Yukun 1,2; Zhang, Jinsong 1; Chen, Jichun 1
通讯作者	Chen, Jichun(jchchen@imr.ac.cn)
	2021-09-06
发表期刊	JOURNAL OF THE AMERICAN CERAMIC SOCIETY
ISSN	0002-7820
页码	13
摘要	Silver-titanium (Ag-Ti) paste was used to prepare copper-metalized aluminum nitride (AlN) substrate under 2 MPa by brazing. The effects of Ti concentration and brazing temperature on interfacial microstructure were evaluated. The evolution of the interfacial microstructure was examined based on six types of samples. The growth of TiN reaction layer at the AlN/Cu interface is from the island type to the continuous type, and then grows and thickens along the AlN grain boundary until the superficial AlN grains transform into TiN completely. The peeling strength increases as TiN reaction layer tends to be continuous, and reaches the maximum value of 34.6 N/mm. The copper-metalized AlN substrates crack at the AlN ceramic, accompanied by the local plastic deformation of the copper foil, and then form the typical wave fracture. With further thickening of TiN reaction layer, the porous TiN layer becomes the weak link, and peeling strength decreased.
关键词	active metal brazing aluminum nitride fracture microstructure strength
DOI	10.1111/jace.18092
收录类别	SCI
语种	英语
WOS研究方向	Materials Science
WOS类目	Materials Science, Ceramics
WOS记录号	WOS:000692644600001
出版者	WILEY
引用统计	被引频次：14[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/166896
专题	中国科学院金属研究所
通讯作者	Chen, Jichun
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Yukun,Zhang, Jinsong,Chen, Jichun. Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu-metalized AlN substrate[J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY,2021:13.
APA	Zhang, Yukun,Zhang, Jinsong,&Chen, Jichun.(2021).Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu-metalized AlN substrate.JOURNAL OF THE AMERICAN CERAMIC SOCIETY,13.
MLA	Zhang, Yukun,et al."Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu-metalized AlN substrate".JOURNAL OF THE AMERICAN CERAMIC SOCIETY (2021):13.