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Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces
Gao, Zhaoqing1,2,3; Wang, Chen1; Gao, Nan1; Guo, Shihao1; Chen, Yinbo2,3; Chai, Zhenbang1,4; Wang, Yunpeng1; Ma, Haitao1
Corresponding AuthorWang, Yunpeng(yunpengw@dlut.edu.cn) ; Ma, Haitao(htma@dlut.edu.cn)
2022-06-01
Source PublicationSURFACES AND INTERFACES
ISSN2468-0230
Volume30Pages:12
AbstractIn this study, the long-term (up to 400 days) room temperature aging tests for Ga-21.5In-10Sn/Cu interface were investigated, confirming the formation of intermetallic compounds at room temperature could cause the serious interfacial instability issues. One novel strategy using solid solution alloys with high thermal stability and high diffusion activation energy to design the barrier layer materials to inhibit the diffusion of solid atoms or interfacial reactions was proposed. The feasibility of Ni-W and Ni-W-graphene coatings as the interfacial reaction barrier of Ga-21.5In-10Sn/Cu liquid-solid interfaces was explored, indicating a novel application of Ni-W electroplated coatings in electronic/electrical contacts fields besides these traditional applications in wear-resistance, corrosion-resistance and heat corrosion resistance fields. The challenging agglomeration issues of graphene in water soluble solutions was successfully solved using the ethylene glycol as the effective dispersant. The temperature dependence of Ni-W and Ni-W-graphene coatings as the interfacial reaction barrier was compared. It was preliminarily contended that the addition of graphene particles was detrimental to improve the reaction barrier properties of Ni-W matrix. This finding provides a novel strategy to solve the interfacial instability problem of Ga-21.5In-10Sn/Cu interfaces and will enable wider applications of electroplated Ni-W coatings, promoting the development of soft and stretchable Ga-based alloys/Cu conductors in wearable electronics.
KeywordNi-W-graphene coatings Interfacial reaction barrier CuGa 2 layer Ga-21 5In-10Sn liquid alloys Ni -W solid solution
Funding OrganizationNation Natural Science Foundation of China
DOI10.1016/j.surfin.2022.101838
Indexed BySCI
Language英语
Funding ProjectNation Natural Science Foundation of China[51871040]
WOS Research AreaChemistry ; Materials Science ; Physics
WOS SubjectChemistry, Physical ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter
WOS IDWOS:000782283600002
PublisherELSEVIER
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/172834
Collection中国科学院金属研究所
Corresponding AuthorWang, Yunpeng; Ma, Haitao
Affiliation1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
4.Tokyo Inst Technol, Dept Mat Sci & Engn, Tokyo 1528552, Japan
Recommended Citation
GB/T 7714
Gao, Zhaoqing,Wang, Chen,Gao, Nan,et al. Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces[J]. SURFACES AND INTERFACES,2022,30:12.
APA Gao, Zhaoqing.,Wang, Chen.,Gao, Nan.,Guo, Shihao.,Chen, Yinbo.,...&Ma, Haitao.(2022).Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces.SURFACES AND INTERFACES,30,12.
MLA Gao, Zhaoqing,et al."Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces".SURFACES AND INTERFACES 30(2022):12.
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