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Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires
Sun, Pengfei1,2; Li, Zhiwei3; Hou, Jiapeng1; Xu, Aimin3; Wang, Qiang1; Zhang, Yi3; Zhang, Zhenjun1; Zhang, Penglin2; Zhang, Zhefeng1
Corresponding AuthorHou, Jiapeng(jphou@imr.ac.cn) ; Zhang, Yi(zhfzhang@imr.ac.cn)
2022-03-27
Source PublicationADVANCED ENGINEERING MATERIALS
ISSN1438-1656
Pages13
AbstractIn the process of electric power transmission, the defects in the copper wire interact with the electrons which results in a thermal effect, accordingly, causing the changes of microstructure and properties of the copper wire. Herein, the evolution of microstructure, strength, and electrical conductivity of the oxygen-free copper wires annealed at different temperatures is investigated. In addition, the effects of various microstructures on strength and electrical conductivity are quantitatively revealed. In the low-temperature region (80-150 degrees C), dislocation recovery is the main reason for the decrease in strength; while, the increase in electrical conductivity is mainly due to the decrease in dislocation density and the transformation of grain boundary from nonequilibrium state to equilibrium state. In the high-temperature region (above 210 degrees C), the strength loss is mainly related to the increasing recrystallized grain size and the disappearance of dislocations in the recrystallized region. The increase in electrical conductivity is mainly attributed to the significant decrease in grain boundary density and the further recovery of dislocations.
Keywordannealing electrical conductivity microstructure evolution oxygen-free copper wire strength
Funding OrganizationNational Natural Science Foundation of China ; State Grid Corporation of China ; China Postdoctoral Science Foundation
DOI10.1002/adem.202200037
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China[52001313] ; State Grid Corporation of China[5211HD210003] ; China Postdoctoral Science Foundation[2019M661151]
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000773409700001
PublisherWILEY-V C H VERLAG GMBH
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/173039
Collection中国科学院金属研究所
Corresponding AuthorHou, Jiapeng; Zhang, Yi
Affiliation1.Chinese Acad Sci, Inst Met Res, Shi Changxu Innovat Ctr Adv Mat, 72 Wenhua Rd, Shenyang 110016, Peoples R China
2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China
3.Zhejiang Huadian Equipment Testing Inst, Natl Qual Supervis & Inspect Ctr Elect Equipment, Hangzhou 310015, Peoples R China
Recommended Citation
GB/T 7714
Sun, Pengfei,Li, Zhiwei,Hou, Jiapeng,et al. Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires[J]. ADVANCED ENGINEERING MATERIALS,2022:13.
APA Sun, Pengfei.,Li, Zhiwei.,Hou, Jiapeng.,Xu, Aimin.,Wang, Qiang.,...&Zhang, Zhefeng.(2022).Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires.ADVANCED ENGINEERING MATERIALS,13.
MLA Sun, Pengfei,et al."Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires".ADVANCED ENGINEERING MATERIALS (2022):13.
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